SCHEMBL767031

SCHEMBL767031

CC1C(C)C1[O]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8497369 1.00
SCHEMBL8497372 1.00
SCHEMBL8498792 1.00
SCHEMBL7953133 0.63 LMNA (0.30)
SCHEMBL282507 0.63
SCHEMBL11046561 0.63 LMNA (0.30)
SCHEMBL865334 0.56
SCHEMBL603171 0.56
Hydrochloric Acid SCHEMBL25253221 0.54
SCHEMBL7872166 0.54

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 208 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240231230-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM NISSAN CHEMICAL CORPORATION (JP) 2024-07-11 US disclosed
US-20240201593-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM NISSAN CHEMICAL CORPORATION (JP) 2024-06-20 US disclosed
CN-118159910-A Additive-containing silicon-containing resist underlayer film forming composition 日产化学株式会社 2024-06-07 CN disclosed
CN-113518762-B Release layer dispersion of layered compound and transparent substrate using the same 公立大学法人大阪 2024-05-28 CN disclosed
US-20240162086-A1 SUBSTRATE WITH THIN FILM, AND SEMICONDUCTOR SUBSTRATE NISSAN CHEMICAL CORPORATION (JP) 2024-05-16 US disclosed
CN-114341232-B Process for producing silicon-containing polymer composition 日产化学株式会社 2024-05-07 CN disclosed
CN-117940850-A Composition for forming silicon-containing resist underlayer film, laminate using same, and method for producing semiconductor element 日产化学株式会社 2024-04-26 CN disclosed
US-11966164-B2 Semiconductor device production method employing silicon-containing resist underlayer film-forming composition including organic group having ammonium group NISSAN CHEMICAL CORPORATION (JP) 2024-04-23 US disclosed
US-11961636-B2 Silica-containing insulating composition NISSAN CHEMICAL CORPORATION (JP) 2024-04-16 US disclosed
WO-2024063044-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM 日産化学株式会社 2024-03-28 WO disclosed
US-20120070994-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION CONTAINING SILICON HAVING SULFIDE BOND NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2012-03-22 US disclosed
US-20110287369-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION CONTAINING SILICON HAVING ANION GROUP NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2011-11-24 US disclosed
EP-2372458-A1 SILICON-CONTAINING RESIST UNDERLAYER FILM FORMATION COMPOSITION HAVING ANION GROUP Nissan Chemical Industries, Ltd. (JP) 2011-10-05 EP disclosed
EP-2336256-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM WITH ONIUM GROUP Nissan Chemical Industries, Ltd. (JP) 2011-06-22 EP disclosed
US-20110143149-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION CONTAINING SILICONE HAVING ONIUM GROUP NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2011-06-16 US disclosed
US-20100330505-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION CONTAINING SILICONE HAVING CYCLIC AMINO GROUP NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2010-12-30 US disclosed
US-20100304305-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION CONTAINING POLYMER HAVING NITROGEN-CONTAINING SILYL GROUP NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2010-12-02 US disclosed
US-20100291487-A1 SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION HAVING UREA GROUP NISSAN CHEMICAL INDUSTRIES LTD. (JP) 2010-11-18 US disclosed
EP-2249204-A1 SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING CYCLIC AMINO GROUP Nissan Chemical Industries, Ltd. (JP) 2010-11-10 EP disclosed
EP-2196854-A1 COMPOSITION CONTAINING POLYMER HAVING NITROGENOUS SILYL GROUP FOR FORMING RESIST UNDERLAYER FILM Nissan Chemical Industries, Ltd. (JP) 2010-06-16 EP disclosed