Propane

Propane

SCHEMBL7708559

CCC.F.F.F.F.F.F

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Propane SCHEMBL11764249 1.00 TSHR (0.38)
Propane SCHEMBL8444696 1.00
Propane SCHEMBL27735195 1.00
Propane SCHEMBL28758767 1.00
Propane SCHEMBL787113 1.00 TSHR (0.38)
Propane SCHEMBL28670151 1.00
Propane SCHEMBL7997861 1.00 TSHR (0.38)
Propane SCHEMBL787112 1.00 TSHR (0.38)
Propane SCHEMBL27793722 0.91
Propane SCHEMBL27383303 0.91 ALDH1A1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230193075-A1 POLYAMIC ACID HAVING SPECIFIC COMPOSITION, VARNISH, CURED PRODUCT, AND COMPOSITE MATERIAL KANEKA CORPORATION (JP) 2023-06-22 US claimed
US-20230042415-A1 POLYAMIC ACID HAVING SPECIFIC COMPOSITION, VARNISH, CURED PRODUCT, AND COMPOSITE MATERIAL KANEKA CORPORATION (JP) 2023-02-09 US claimed
EP-4130099-A1 POLYAMIC ACID HAVING SPECIFIC COMPOSITION, VARNISH, CURED PRODUCT, AND COMPOSITE MATERIAL Kaneka Corporation (JP) 2023-02-08 EP claimed
US-20210340327-A1 IMIDE OLIGOMER, VARNISH, CURED PRODUCTS THEREOF, AND PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL USING THESE KANEKA CORPORATION (JP) 2021-11-04 US claimed
JP-61020724-A None JP disclosed
JP-11093294-A None JP disclosed
JP-2043205-A None JP disclosed
JP-6240138-A None JP disclosed
US-20230193075-A1 POLYAMIC ACID HAVING SPECIFIC COMPOSITION, VARNISH, CURED PRODUCT, AND COMPOSITE MATERIAL KANEKA CORPORATION (JP) 2023-06-22 US disclosed
US-20230042415-A1 POLYAMIC ACID HAVING SPECIFIC COMPOSITION, VARNISH, CURED PRODUCT, AND COMPOSITE MATERIAL KANEKA CORPORATION (JP) 2023-02-09 US disclosed
EP-4130099-A1 POLYAMIC ACID HAVING SPECIFIC COMPOSITION, VARNISH, CURED PRODUCT, AND COMPOSITE MATERIAL Kaneka Corporation (JP) 2023-02-08 EP disclosed
US-20210340327-A1 IMIDE OLIGOMER, VARNISH, CURED PRODUCTS THEREOF, AND PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL USING THESE KANEKA CORPORATION (JP) 2021-11-04 US disclosed
US-6348284-B1 Non-sintered nickel electrode for a secondary electro-chemical cell having an alkaline electrolyte ALCATEL (FR) 2002-02-19 US disclosed
US-6090183-A Method and apparatus for processing exhaust gas produced during manufacturing of semi-conductor devices AWAJI TOSHIO (JP) 2000-07-18 US disclosed
JP-H1193294-A ALUMINIUM POROUS SOUND ABSORBING MATERIAL YUNIKKUSU:KK 1999-04-06 JP disclosed
JP-H06240138-A POLYIMIDE RESIN COMPOSITION FOR SLIDING MATERIAL NTN CORP 1994-08-30 JP disclosed
EP-0294195-B1 Polyimide resin composition MITSUI TOATSU CHEMICALS (JP) 1993-11-24 EP disclosed
JP-H0243205-A SEALING RESIN COMPOSITION FOR SEMICONDUCTOR MITSUI TOATSU CHEM INC 1990-02-13 JP disclosed
JP-S6120724-A THERMALLY RESTORABLE ARTICLE SUMITOMO ELECTRIC IND LTD 1986-01-29 JP disclosed
JP-S06120724-A 0001-01-01 JP disclosed