⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30522790 | 1.00 | — | — | |
| SCHEMBL28117271 | 1.00 | — | — | |
| SCHEMBL28328690 | 1.00 | — | — | |
| SCHEMBL771067 | 1.00 | — | — | |
| SCHEMBL9645575 | 0.82 | — | — | |
| SCHEMBL4948743 | 0.82 | — | — | |
| SCHEMBL10721912 | 0.82 | — | — | |
| Water SCHEMBL3795353 | 0.82 | — | — | |
| SCHEMBL10721896 | 0.82 | — | — | |
| SCHEMBL9711048 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 2176 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-224288219-U | Fuse structure of full-range protection fuse | XI'AN HONGFA ELECTRIC APPLIANCE Co.,Ltd. (CN) | 2026-05-26 | — | — | CN | claimed |
| CN-116477567-B | Packaging method and structure of MEMS device | 五邑大学 | 2026-02-27 | — | — | CN | claimed |
| US-20260005670-A1 | FBAR STRUCTURE HAVING SINGLE CRYSTALLINE PIEZOELECTRIC LAYER AND FABRICATING METHOD THEREOF | SHENZHEN NEWSONIC TECH CO LTD (CN) | 2026-01-01 | — | — | US | claimed |
| US-20250353736-A1 | SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2025-11-20 | — | — | US | claimed |
| US-12454455-B2 | Semiconductor structure and method of making | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED (TW) | 2025-10-28 | — | — | US | claimed |
| US-20250197198-A1 | MANUFACTURING PROCESS FOR MICROELECTROMECHANICAL DEVICES HAVING IMPROVED SEALING PERFORMANCE | STMICROELECTRONICS INTERNATIONAL N.V. (CH) | 2025-06-19 | — | — | US | claimed |
| EP-4571249-A1 | MANUFACTURING PROCESS FOR MICROELECTROMECHANICAL DEVICES HAVING IMPROVED SEALING PERFORMANCE | STMicroelectronics International N.V. (CH) | 2025-06-18 | — | — | EP | claimed |
| CN-120161215-A | MEMS triaxial accelerometer with self-checking function and preparation method thereof | 合肥工业大学 | 2025-06-17 | — | — | CN | claimed |
| CN-120157082-A | Process for manufacturing microelectromechanical devices with improved sealing properties | 意法半导体国际公司 | 2025-06-17 | — | — | CN | claimed |
| CN-119147603-B | Electrochemical aptamer sensor and preparation method and application thereof | 北京市科学技术研究院城市安全与环境科学研究所 | 2025-06-13 | — | — | CN | claimed |
| WO-1997005477-A1 | COMPOSITE MEMBRANE SENSOR | AUSTRALIAN MEMBRANE AND BIOTECHNOLOGY RESEARCH INSTITUTE (AU) | 1997-02-13 | — | — | WO | claimed |
| EP-0434264-B1 | Package for power semiconductor components | WESTINGHOUSE ELECTRIC CORP (US) | 1994-10-12 | — | — | EP | claimed |
| US-5182632-A | High density multichip package with interconnect structure and heatsink | TACTICAL FABS, INC. (US) | 1993-01-26 | — | — | US | claimed |
| EP-0434264-A2 | Package for power semiconductor components | WESTINGHOUSE ELECTRIC CORPORATION (US) | 1991-06-26 | — | — | EP | claimed |
| WO-1991007777-A1 | HIGH DENSITY MULTICHIP PACKAGE | TACTICAL FABS, INC. (US) | 1991-05-30 | — | — | WO | claimed |
| US-4746893-A | Pressure transducer with sealed conductors | MOTOROLA, INC. (US) | 1988-05-24 | — | — | US | claimed |
| US-4701424-A | Hermetic sealing of silicon | FORD MOTOR COMPANY (US) | 1987-10-20 | — | — | US | claimed |
| US-4617606-A | Capacitive pressure transducer | MOTOROLA, INC. (US) | 1986-10-14 | — | — | US | claimed |
| US-4109269-A | OPTO-COUPLER SEMICONDUCTOR DEVICE | NATIONAL SEMICONDUCTOR CORPORATION (US) | 1978-08-22 | — | — | US | claimed |
| US-3986251-A | Germanium doped light emitting diode bonding process | MOTOROLA, INC. (US) | 1976-10-19 | — | — | US | claimed |