SCHEMBL7739592

SCHEMBL7739592

CC1(C(=O)OC(=O)C2(C)CCCCC2)CCCCC1

nearest known ligand 0.45

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.45
SMN1; SMN2 Q16637 2/20 0.45
FFAR3 O14843 1/20 0.43
CYP3A4 P08684 2/20 0.38
MEN1 O00255 1/20 0.38
KMT2A Q03164 1/20 0.38
P2RX7 Q99572 1/20 0.37
NPSR1 Q6W5P4 1/20 0.37
CETP P11597 2/20 0.34
TSHR P16473 1/20 0.32
CCR2 P41597 1/20 0.32
MAPT P10636 1/20 0.32
HSD11B1 P28845 1/20 0.31
CYP4F2 P78329 1/20 0.31
CYP4A11 Q02928 1/20 0.31
CYP2C19 P33261 1/20 0.30
CYP19A1 P11511 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12910473 0.86 HSD17B10 (0.42) ALDH1A1SMN1; SMN2FFAR3CYP3A4MEN1
SCHEMBL4726410 0.86 ALDH1A1 (0.40) ALDH1A1SMN1; SMN2FFAR3CYP3A4MEN1
SCHEMBL8527912 0.82 FFAR3 (0.42) ALDH1A1SMN1; SMN2FFAR3CYP3A4MEN1
SCHEMBL17852 0.82 NPSR1 (0.50) ALDH1A1SMN1; SMN2FFAR3CYP3A4MEN1
SCHEMBL14445398 0.82 NPSR1 (0.50) ALDH1A1SMN1; SMN2FFAR3CYP3A4MEN1
SCHEMBL1439569 0.80 FFAR3 (0.40) ALDH1A1SMN1; SMN2FFAR3CYP3A4MEN1
SCHEMBL7527879 0.80 ALDH1A1 (0.42) ALDH1A1SMN1; SMN2FFAR3CYP3A4MEN1
SCHEMBL21510462 0.80 FFAR3 (0.40) ALDH1A1SMN1; SMN2FFAR3CYP3A4MEN1
Hydrochloric Acid SCHEMBL27468145 0.80 NPSR1 (0.48) ALDH1A1SMN1; SMN2FFAR3CYP3A4MEN1
SCHEMBL17958 0.79 NPSR1 (0.52) ALDH1A1SMN1; SMN2FFAR3CYP3A4MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116285810-A PCB packaging adhesive and preparation method thereof 深圳市汉思新材料科技有限公司 2023-06-23 CN disclosed
CN-114685935-A Low-dielectric-constant resin composition and preparation method and application thereof 衡所华威电子有限公司 2022-07-01 CN disclosed
US-9409931-B1 3-O-acyl-ingenol analogues LEO LABORATORIES LIMITED (IE) 2016-08-09 US disclosed
US-9409931-B1 3-O-acyl-ingenol analogues LEO LABORATORIES LIMITED (IE) 2016-08-09 US disclosed
US-9409931-B1 3-O-acyl-ingenol analogues LEO LABORATORIES LIMITED (IE) 2016-08-09 US disclosed
US-6410748-B1 Alicycli c group-containing monomer KABUSHIKI KAISHA TOSHIBA (JP) 2002-06-25 US disclosed
US-6291129-B1 LIGHT SENSITIVE ELEMENT WITH UNSATURATED POLYMERS KABUSHIKI KAISHA TOSHIBA (JP) 2001-09-18 US disclosed