SCHEMBL775316

SCHEMBL775316

[Hf].[N].[O].[Si]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5412286 0.87
SCHEMBL3620782 0.87
SCHEMBL5706295 0.87
SCHEMBL895890 0.87
SCHEMBL9716108 0.87
SCHEMBL10890316 0.87
SCHEMBL11576845 0.75
Fluoride SCHEMBL7090993 0.75
SCHEMBL5013176 0.75
SCHEMBL8506328 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 124 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103594374-B Semiconductor device manufacturing method 中国科学院微电子研究所 2017-03-08 CN claimed
CN-102737999-B Method for preparing metal-oxide-semiconductor field effect transistor on germanium substrate INST OF MICROELECTRONICS CAS 2015-02-11 CN claimed
US-8921935-B2 Semiconductor device SAMSUNG ELECTRONICS CO., LTD. (KR) 2014-12-30 US claimed
CN-103594374-A Semiconductor device manufacturing method INST OF MICROELECTRONICS CAS 2014-02-19 CN claimed
CN-102737999-A Method for preparing metal-oxide-semiconductor field effect transistor on germanium substrate INST OF MICROELECTRONICS CAS 2012-10-17 CN claimed
US-20120175703-A1 SEMICONDUCTOR DEVICE SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-07-12 US claimed
CN-102103983-B Method for preparing metal-oxide-semiconductor capacitor on germanium substrate INST OF MICROELECTRONICS CAS 2012-06-20 CN claimed
CN-101800178-B Preparation method of hafnium silicon aluminum oxygen nitrogen high dielectric constant gate dielectric INST OF MICROELECTRONICS CAS 2012-05-30 CN claimed
CN-102341894-A Dual metal and dual dielectric integration for metal high-k FETs IBM 2012-02-01 CN claimed
CN-102103983-A Method for preparing metal-oxide-semiconductor capacitor on germanium substrate INST OF MICROELECTRONICS CAS 2011-06-22 CN claimed
CN-101447420-A Method for preparing high-dielectric-constant gate dielectric film hafnium silicon oxygen nitrogen INST OF MICROELECTRONICS CAS (CN) 2009-06-03 CN claimed
CN-107799464-B Semiconductor device and method for manufacturing the same 三星电子株式会社 2023-09-08 CN disclosed
CN-110504303-A Tunneling field effect transistor device TAIWAN SEMICONDUCTOR MFG CO LTD 2019-11-26 CN disclosed
CN-106057797-B Mixed active-field gap extends drain MOS transistor 德克萨斯仪器股份有限公司 2019-09-27 CN disclosed
US-10269629-B2 Semiconductor device and method of manufacturing the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2019-04-23 US disclosed
CN-1934685-A Stabilization method of high-k dielectric materials APPLIED MATERIALS INC (US) 2007-03-21 CN disclosed
CN-1757114-A Charge-trapping memory arrays SPANSION LLC SUNNYVALE (US) 2006-04-05 CN disclosed
CN-1662674-A System for depositing a film onto a substrate using a low vapor pressure gas precursor MATTSON TECH INC (US) 2005-08-31 CN disclosed
US-20040247787-A1 Effluent pressure control for use in a processing system MATTSON TECHNOLOGY, INC. 2004-12-09 US disclosed
US-20040025787-A1 System for depositing a film onto a substrate using a low pressure gas precursor MATTSON TECHNOLOGY, INC. 2004-02-12 US disclosed