SCHEMBL895890

SCHEMBL895890

[N].[O].[Si]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10890316 1.00
SCHEMBL5412286 1.00
SCHEMBL31290124 0.87
SCHEMBL11576845 0.87
SCHEMBL2254437 0.87
Fluoride SCHEMBL7090993 0.87
SCHEMBL9188599 0.87
SCHEMBL775316 0.87
SCHEMBL8506328 0.87
Charcoal, Activated SCHEMBL138810 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1286 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114784061-B Display panel and preparation method thereof 深圳市华星光电半导体显示技术有限公司 2025-06-17 CN claimed
US-20250127011-A1 DISPLAY PANEL SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. (CN) 2025-04-17 US claimed
CN-119495670-A Semiconductor structure, manufacturing method thereof and electronic equipment 华为技术有限公司 2025-02-21 CN claimed
US-12213370-B2 Display panel and method of manufacturing the same SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. (CN) 2025-01-28 US claimed
CN-118280994-A Semiconductor structure and forming method thereof 中芯国际集成电路制造(上海)有限公司 2024-07-02 CN claimed
CN-117049470-B MEMS device vacuum packaging method 北京中科格励微科技有限公司 2024-06-18 CN claimed
CN-118198285-A Sodium battery anode material, preparation method and application 溧阳天目先导电池材料科技有限公司 2024-06-14 CN claimed
CN-118073430-A Transparent laminated passivation film structure and preparation method and application thereof 中科研和(宁波)科技有限公司 2024-05-24 CN claimed
CN-117790456-A Chip, preparation method thereof and electronic equipment 华为技术有限公司 2024-03-29 CN claimed
US-20240032384-A1 DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. (CN) 2024-01-25 US claimed
WO-1995007820-A1 PASSIVATION OF CERAMIC PIEZOELECTRIC INK JET PRINT HEADS XAAR LIMITED (GB) 1995-03-23 WO claimed
EP-0613178-A2 Integrated circuits protected from the environment by ceramic and barrier metal layers DOW CORNING CORPORATION (US) 1994-08-31 EP claimed
EP-0596678-A2 Vapor phase deposition of hydrogen silsesquioxane resin in the presence of nitrous oxide DOW CORNING CORPORATION (US) 1994-05-11 EP claimed
EP-0590781-A1 Hermetic protection for integrated circuits, based on a ceramic layer DOW CORNING CORPORATION (US) 1994-04-06 EP claimed
EP-0590780-A1 Hermetic protection for integrated circuits, based on a ceramic layer DOW CORNING CORPORATION (US) 1994-04-06 EP claimed
EP-0589678-A2 Hermetic protection for integrated circuits DOW CORNING CORPORATION (US) 1994-03-30 EP claimed
EP-0588577-A2 Hermetically sealed integrated circuits DOW CORNING CORPORATION (US) 1994-03-23 EP claimed
EP-0516308-A1 Vapor phase deposition of hydrogen silsesquioxane resin DOW CORNING CORPORATION (US) 1992-12-02 EP claimed
US-5165955-A METHOD OF DEPOSITING A COATING CONTAINING SILICON AND OXYGEN DOW CORNING CORPORATION (US) 1992-11-24 US claimed
US-4268452-A HYDROXY-TERMINATED POLYSILOXANE, FILLER, SILICON COMPOUND WITH SILICON-NITROGEN OR SILICON-OXY-NITROGEN BONDS TORAY SILICONE COMPANY, LTD. (JP) 1981-05-19 US claimed