SCHEMBL7754152

SCHEMBL7754152

CCCCC(OOCC)C(=O)O

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA2 P00918 5/20 0.45
MAPK1 P28482 1/20 0.45
GPR84 Q9NQS5 3/20 0.39
FFAR1 O14842 1/20 0.39
SLC1A3 P43003 1/20 0.39
SLC1A2 P43004 1/20 0.39
SLC1A1 P43005 1/20 0.39
PTGES O14684 1/20 0.38
ALOX5 P09917 1/20 0.38
PPARG P37231 1/20 0.38
MAPT P10636 1/20 0.38
LCK P06239 1/20 0.38
PPARD Q03181 1/20 0.38
ZDHHC20 Q5W0Z9 1/20 0.38
ZDHHC2 Q9UIJ5 1/20 0.38
CA1 P00915 4/20 0.37
CHRM1 P11229 1/20 0.37
AKR1A1 P14550 1/20 0.37
CHRM3 P20309 1/20 0.37
HTR2A P28223 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5845999 0.86 CA2 (0.44) CA2MAPK1GPR84FFAR1SLC1A3
SCHEMBL28573796 0.85 CA2 (0.42) CA2MAPK1GPR84FFAR1SLC1A3
SCHEMBL29162228 0.83 GPR84 (0.44) CA2MAPK1GPR84FFAR1PTGES
SCHEMBL23531359 0.82 CA2 (0.47) CA2MAPK1GPR84FFAR1SLC1A3
SCHEMBL791193 0.81 GPR84 (0.46) CA2GPR84FFAR1SLC1A2SLC1A1
SCHEMBL2573721 0.81 CA2 (0.54) CA2MAPK1GPR84FFAR1SLC1A3
SCHEMBL28638247 0.80 CYP3A4 (0.50) CA2MAPK1TDP1
SCHEMBL28662464 0.80 TSHR (0.40) CA2MAPK1GPR84FFAR1SLC1A3
SCHEMBL902514 0.80 CA2 (0.45) CA2MAPK1GPR84FFAR1SLC1A3
SCHEMBL6275999 0.80 CA2 (0.45) CA2MAPK1GPR84FFAR1SLC1A3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 94 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105717743-B Photosensitive resin composition and application thereof 奇美实业股份有限公司 2021-12-21 CN claimed
CN-105717747-B Photosensitive resin composition and application thereof 奇美实业股份有限公司 2021-12-21 CN claimed
CN-103265661-B Coating and conductive resin of film zinc coat HUNAN JINPAN NEW MATERIAL TECHNOLOGY CO LTD 2015-02-04 CN claimed
CN-101612553-B Radical post-crosslinking adsorbent and preparation method thereof ROHM & HAAS 2013-11-06 CN claimed
EP-2454287-B1 HIGH PRESSURE RADICAL POLYMERIZATION PROCESS EXXONMOBIL CHEM PATENTS INC (US) 2013-04-17 EP claimed
CN-102762641-A High-speed cross-linking system ARKEMA FRANCE 2012-10-31 CN claimed
CN-101510615-B Semi-interpenetrating network type composite proton exchange film based on crosslinkable medlin and preparation method thereof UNIV TONGJI 2012-02-29 CN claimed
CN-101612553-A Radical post-crosslinking adsorbent and preparation method thereof ROHM & HAAS 2009-12-30 CN claimed
CN-101510615-A Semi-interpenetrating network type composite proton exchange film based on crosslinkable medlin and preparation method thereof UNIV TONGJI (CN) 2009-08-19 CN claimed
CN-100503652-C Method for the production of aqueous polymer dispersions containing very few residual monomers and use thereof CELANESE EMULSIONS GMBH (DE) 2009-06-24 CN claimed
CN-101367903-A Enhancement type composite proton exchanging film based on semi-interpenetrating network UNIV TONGJI (CN) 2009-02-18 CN claimed
CN-1681849-A Method for producing aqueous polymer dispersions containing only very little residual monomers and use thereof CELANESE EMULSIONS GMBH (DE) 2005-10-12 CN claimed
CN-1057847-A The lower optical densities polymkeric substance that photoresist material and optical application are used and the preparation method of multipolymer HOECHST CELANESE CORP (US) 1992-01-15 CN claimed
EP-4232276-A1 LASER ENGRAVABLE LABELS Röhm GmbH (DE) 2023-08-30 EP disclosed
EP-4165118-A1 THERMOPLASTIC MOULDING COMPOSITION WITH IMPROVED WEATHERING RESISTANCE Röhm GmbH (DE) 2023-04-19 EP disclosed
EP-4165123-A1 PROCESS FOR COLOURING A THERMOPLASTIC POLYMER Röhm GmbH (DE) 2023-04-19 EP disclosed
CN-1136324-A Photosolder resist ink, printed circuit board, and process for producing the same GOO CHEMICAL CO LTD (JP) 1996-11-20 CN disclosed
CN-1021450-C Process for preparing stereostable nonaqueous dispersions of polyepoxides having high epoxy equivalent weight ICI PLC (GB) 1993-06-30 CN disclosed
CN-1057847-A The lower optical densities polymkeric substance that photoresist material and optical application are used and the preparation method of multipolymer HOECHST CELANESE CORP (US) 1992-01-15 CN disclosed
CN-1033816-A Improve the method for epoxy equivalent (weight) value in the epoxide ICI PLC (GB) 1989-07-12 CN disclosed