Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.40 |
| ▸ | CA1 | P00915 | 1/20 | 0.31 |
| ▸ | CA2 | P00918 | 1/20 | 0.31 |
| ▸ | DNM1 | Q05193 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5595949 | 0.89 | LMNA (0.36) | LMNADNM1 | |
| SCHEMBL28492495 | 0.88 | LMNA (0.46) | LMNADNM1 | |
| SCHEMBL28496866 | 0.88 | LMNA (0.46) | LMNADNM1 | |
| SCHEMBL14656890 | 0.88 | LMNA (0.46) | LMNADNM1 | |
| SCHEMBL11026294 | 0.88 | LMNA (0.46) | LMNADNM1 | |
| SCHEMBL7176945 | 0.86 | LMNA (0.34) | LMNADNM1 | |
| SCHEMBL2761426 | 0.82 | LMNA (0.41) | LMNADNM1 | |
| SCHEMBL28550781 | 0.81 | LMNA (0.40) | LMNADNM1 | |
| SCHEMBL5596190 | 0.79 | LMNA (0.33) | LMNA | |
| SCHEMBL455159 | 0.78 | LMNA (0.42) | LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114460809-A | Negative photosensitive resin composition, cured film, display device provided with cured film, and method for producing same | 东丽株式会社 | 2022-05-10 | — | — | CN | disclosed |
| CN-109071366-B | Surface applied corrosion inhibitor | 建筑研究和技术有限公司 | 2022-05-10 | — | — | CN | disclosed |
| CN-108885399-B | Negative photosensitive resin composition, cured film, display device provided with cured film, and method for producing same | 东丽株式会社 | 2022-03-15 | — | — | CN | disclosed |
| CN-108604062-B | Negative photosensitive resin composition, cured film, display device having cured film, and method for producing same | 东丽株式会社 | 2021-11-09 | — | — | CN | disclosed |
| US-11086219-B2 | Negative-type photosensitive resin composition, cured film, display device that includes the cured film, and production method therefor | TORAY INDUSTRIES, INC. (JP) | 2021-08-10 | — | — | US | disclosed |
| CN-107077070-B | Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device | 东丽株式会社 | 2020-06-16 | — | — | CN | disclosed |
| EP-3203320-B9 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2020-05-06 | — | — | EP | disclosed |
| EP-3203320-B1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2019-10-23 | — | — | EP | disclosed |
| US-10409163-B2 | Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2019-09-10 | — | — | US | disclosed |
| US-20180356729-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, DISPLAY DEVICE THAT INCLUDES THE CURED FILM, AND PRODUCTION METHOD THEREFOR | TORAY INDUSTRIES, INC. (JP) | 2018-12-13 | — | — | US | disclosed |
| CN-107710890-A | Method for manufacturing printed wiring board, surface-treated copper foil, laminate, printed wiring board, semiconductor package, and electronic device | ＪＸ金属株式会社 | 2018-02-16 | — | — | CN | disclosed |
| US-20170285477-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2017-10-05 | — | — | US | disclosed |
| US-20170243737-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2017-08-24 | — | — | US | disclosed |
| EP-3203320-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Toray Industries, Inc. (JP) | 2017-08-09 | — | — | EP | disclosed |
| EP-3125274-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | Toray Industries, Inc. (JP) | 2017-02-01 | — | — | EP | disclosed |
| CN-104685980-A | Production method for multilayer printed wiring board, and base material | JX NIPPON MINING & METALS CORP | 2015-06-03 | — | — | CN | disclosed |
| EP-0713153-B1 | Toner for developing electrostatic images, two component type developer, developing method, image forming method, heat fixing method, and process for producing toner | CANON KK (JP) | 2001-03-14 | — | — | EP | disclosed |
| US-5824442-A | CONTROLLING DEVELOPMENT AND DEVELOPMENT FOR ELECTROSTATIC IMAGES WITH THIN FILMS | CANON KABUSHIKI KAISHA (JP) | 1998-10-20 | — | — | US | disclosed |
| US-5707770-A | TITANIA OR ALUMINA PARTICLES SURFACE TREATED WITH A SILICON COMPOUND OR SILICONE OIL, IMPROVED PERFORMANCE IN HIGH HUMIDITY | CANON KABUSHIKI KAISHA (JP) | 1998-01-13 | — | — | US | disclosed |
| EP-0713153-A2 | Toner for developing electrostatic images, two component type developer, developing method, image forming method, heat fixing method, and process for producing toner | CANON KABUSHIKI KAISHA (JP) | 1996-05-22 | — | — | EP | disclosed |