SCHEMBL7759577

SCHEMBL7759577

C=C(Cc1ccccc1)C(=O)OCC1CO1

nearest known ligand 0.62

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 6/20 0.62
ALDH1A1 P00352 1/20 0.51
TDP1 Q9NUW8 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27623350 0.87 ALDH1A1 (0.59) MGLLALDH1A1
SCHEMBL3593285 0.81 MGLL (0.88) MGLLALDH1A1
SCHEMBL16632271 0.79 ALDH1A1 (0.68) MGLLALDH1A1
SCHEMBL4441961 0.79 ALDH1A1 (0.54) MGLLALDH1A1TDP1
Benzylamine SCHEMBL28872943 0.78 ALDH1A1 (0.66) MGLLALDH1A1TDP1
SCHEMBL908295 0.77 MGLL (0.52) MGLLALDH1A1
SCHEMBL88383 0.77 ALDH1A1 (0.51) MGLLALDH1A1TDP1
Biphenyl SCHEMBL28529224 0.77 ALDH1A1 (0.73) MGLLALDH1A1TDP1
SCHEMBL11164284 0.77 MGLL (0.48) MGLL
SCHEMBL4838795 0.77 ALDH1A1 (0.51) MGLLALDH1A1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111057504-A High-strength patch red glue and preparation method thereof 深圳市邦大科技有限公司 2020-04-24 CN claimed
CN-111057504-A High-strength patch red glue and preparation method thereof 深圳市邦大科技有限公司 2020-04-24 CN disclosed
US-9481779-B2 Fluorescent ink composition, and preparation method therefor KIM HEE JOON (KR) 2016-11-01 US disclosed
US-20150275056-A1 FLUORESCENT INK COMPOSITION, AND PREPARATION METHOD THEREFOR KIM HEE JOON (KR) 2015-10-01 US disclosed
EP-0747770-B1 One-package type photosolder resist composition developable with aqueous alkali solution and method for production of printed circuit board by use thereof TAIYO INK MFG CO LTD (JP) 2001-03-21 EP disclosed
US-5741622-A COMPRISING COPOLYMER HAVING UNSATURATED COMPOUND AND FREE CARBOXYL GROUP, POLYFUNCTIONAL UNSATURATED COMPOND DILUENT, SOLVENT, PHOTOINITIATOR, VINYLTRIAZINE COMPOUND, INORGANIC FILLER TAIYO INK MANUFACTURING CO., LTD. (JP) 1998-04-21 US disclosed
EP-0747770-A2 One-package type photosolder resist composition developable with aqueous alkali solution and method for production of printed circuit board by use thereof TAIYO INK MANUFACTURING CO. LTD. (JP) 1996-12-11 EP disclosed
US-3931430-A Method of desensitizing a pressure sensitive recording sheet and the product thereof KANZAKI PAPER MFG. CO. LTD. (JA) 1976-01-06 US disclosed