SCHEMBL7759893

SCHEMBL7759893

CCC(=CCO[SiH3])CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3482781 0.79 FNTA (0.34)
SCHEMBL9199009 0.77
SCHEMBL3482192 0.75 CES1 (0.33)
SCHEMBL15660436 0.74 BACE1 (0.31)
SCHEMBL62305 0.71
SCHEMBL18145460 0.69
SCHEMBL4996203 0.69
SCHEMBL7915526 0.69
SCHEMBL11788570 0.67 ALDH1A1 (0.48)
SCHEMBL28938437 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5844046-A Process for the preparation of olefin polymer MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1998-12-01 US claimed
US-12534377-B2 Carbon-containing alumina powder, resin composition, heat dissipation component, and method for producing carbon-containing alumina powder DENKA COMPANY LIMITED (JP) 2026-01-27 US disclosed
CN-115348951-B Carbonaceous alumina powder, resin composition, heat radiating member, and process for producing carbonaceous alumina powder 电化株式会社 2024-06-07 CN disclosed
US-20230150830-A1 CARBON-CONTAINING ALUMINA POWDER, RESIN COMPOSITION, HEAT DISSIPATION COMPONENT, AND METHOD FOR PRODUCING CARBON-CONTAINING ALUMINA POWDER DENKA COMPANY LIMITED (JP) 2023-05-18 US disclosed
EP-4129909-A1 CARBON-CONTAINING ALUMINA POWDER, RESIN COMPOSITION, HEAT DISSIPATING COMPONENT, AND METHOD FOR PRODUCING CARBON-CONTAINING ALUMINA POWDER Denka Company Limited (JP) 2023-02-08 EP disclosed
EP-3103842-B1 CURABLE SILICONE COMPOSITION, CURED OBJECT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE DOW TORAY CO LTD (JP) 2023-01-11 EP disclosed
CN-115348951-A Carbon-containing alumina powder, resin composition, heat-dissipating member, and method for producing carbon-containing alumina powder 电化株式会社 2022-11-15 CN disclosed
CN-110088207-B Curable silicone composition and optical semiconductor device using the same 陶氏东丽株式会社 2022-10-14 CN disclosed
EP-3039079-B1 CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE DDP SPECIALTY ELECTRONIC MAT US 9 LLC (US) 2022-05-18 EP disclosed
EP-3103843-B1 CURABLE SILICONE COMPOSITION, CURED OBJECT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE DOW CORNING TORAY CO LTD (JP) 2019-03-27 EP disclosed
WO-2014069610-A1 CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE DOW CORNING TORAY CO., LTD. (JP) 2014-05-08 WO disclosed
WO-2014065432-A1 ORGANOPOLYSILOXANE, CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE DOW CORNING TORAY CO., LTD. (JP) 2014-05-01 WO disclosed
US-6258913-B1 ADDITION-POLYSILOXANE COPOLYMERS WACKER-CHEMIE GMBH (DE) 2001-07-10 US disclosed
EP-0601496-B2 Process for the preparation of olefin polymer MITSUI CHEMICALS INC (JP) 2001-06-27 EP disclosed
EP-0953004-B1 POLYMERIC ORGANOSILICON COMPOUNDS, THEIR PRODUCTION AND USE WACKER CHEMIE GMBH (DE) 2001-04-04 EP disclosed
EP-0953004-A1 POLYMERIC ORGANOSILICON COMPOUNDS, THEIR PRODUCTION AND USE Wacker-Chemie GmbH (DE) 1999-11-03 EP disclosed
US-5844046-A Process for the preparation of olefin polymer MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1998-12-01 US disclosed
WO-1998031727-A1 POLYMERIC ORGANOSILICON COMPOUNDS, THEIR PRODUCTION AND USE WACKER-CHEMIE GMBH (DE) 1998-07-23 WO disclosed
EP-0601496-B1 Process for the preparation of olefin polymer MITSUI PETROCHEMICAL IND (JP) 1997-04-16 EP disclosed
EP-0601496-A1 Process for the preparation of olefin polymer MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1994-06-15 EP disclosed