SCHEMBL776295

SCHEMBL776295

C=CC(=O)OCCn1c(=O)n(CCO)c(=O)n(CCO)c1=O

nearest known ligand 0.55

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.55
ALDH1A1 P00352 5/20 0.46
TP53 P04637 3/20 0.46
HIF1A Q16665 3/20 0.46
CYP3A4 P08684 3/20 0.46
HSD17B10 Q99714 1/20 0.46
HPGD P15428 1/20 0.42
THRB P10828 2/20 0.39
MAPK1 P28482 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
GAA P10253 2/20 0.32
NPSR1 Q6W5P4 2/20 0.31
POLB P06746 1/20 0.31
PLA2G4A P47712 1/20 0.30
MEN1 O00255 1/20 0.30
KMT2A Q03164 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL230828 1.00 TSHR (0.55) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL2730490 0.94 TSHR (0.49) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL42549 0.93 TSHR (0.52) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL9266437 0.91 TSHR (0.46) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL12993031 0.91 TSHR (0.46) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL17589483 0.90 TSHR (0.50) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL27900308 0.89 TSHR (0.47) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL23964456 0.87 TSHR (0.42) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL15631086 0.87 TSHR (0.42) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL2730786 0.86 TSHR (0.46) TSHRALDH1A1TP53HIF1ACYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5777068-A Photosensitive polyimide resin composition NIPPON ZEON CO., LTD. (JP) 1998-07-07 US claimed
US-4911864-A Mixture of (meth)acryloyl group and electroconductive particles NIPPON OIL CO., LTD. (JP) 1990-03-27 US claimed
US-8399172-B2 Negative-working lithographic printing plate precursor and method of lithographic printing using same FUJIFILM CORPORATION (JP) 2013-03-19 US disclosed
US-8399172-B2 Negative-working lithographic printing plate precursor and method of lithographic printing using same FUJIFILM CORPORATION (JP) 2013-03-19 US disclosed
US-8361176-B2 Hydrophilic and hydrophobic silane surface modification of abrasive grains SAINT-GOBAIN ABRASIVES, INC. (US) 2013-01-29 US disclosed
US-20120066980-A1 Hydrophilic and Hydrophobic Silane Surface Modification of Abrasive Grains SAINT-GOBAIN ABRASIFS (FR) 2012-03-22 US disclosed
US-20100055613-A1 NEGATIVE-WORKING LITHOGRAPHIC PRINTING PLATE PRECURSOR AND METHOD OF LITHOGRAPHIC PRINTING USING SAME FUJIFILM CORPORATION (JP) 2010-03-04 US disclosed
US-20100055613-A1 NEGATIVE-WORKING LITHOGRAPHIC PRINTING PLATE PRECURSOR AND METHOD OF LITHOGRAPHIC PRINTING USING SAME FUJIFILM CORPORATION (JP) 2010-03-04 US disclosed
JP-2007271756-A METHOD FOR MANUFACTURING SURFACE RUGGED SHEET NITTO DENKO CORP 2007-10-18 JP disclosed
WO-2006068466-A1 CURABLE COMPOSITION CONTAINING CONDUCTIVE PARTICLES, CURED PRODUCT OF THE CURABLE COMPOSITION, AND LAMINATE JSR CORPORATION (JP) 2006-06-29 WO disclosed
WO-2006022545-A1 CURABLE LIQUID RESIN COMPOSITION JSR CORPORATION (JP) 2006-03-02 WO disclosed
US-5847071-A Photosensitive resin composition HITACHI, CHEMICAL CO., LTD. (JP) 1998-12-08 US disclosed
US-5668248-A POLYAMIC ACID ESTERS HITACHI CHEMICAL CO., LTD. (JP) 1997-09-16 US disclosed
US-5472823-A Polyamic acids HITACHI CHEMICAL CO., LTD. (JP) 1995-12-05 US disclosed
US-5369140-A Hydroxyphenyl triazines, clear topcoats CIBA-GEIGY CORPORATION (US) 1994-11-29 US disclosed
EP-0281365-B1 CURABLE COMPOSITIONS NIPPON OIL CO. LTD. (JP) 1993-06-02 EP disclosed
US-5082598-A Thermosetting unsaturated ester, thiuram compound, crosslinking agent, copper compound NIPPON SHOKUBAI KAGAKU KOGYO CO., LTD. (JP) 1992-01-21 US disclosed
US-4911864-A Mixture of (meth)acryloyl group and electroconductive particles NIPPON OIL CO., LTD. (JP) 1990-03-27 US disclosed
US-4837280-A ACRYLATE GROUP-CONTAINING POLYAROMATIC AMINE COMPOUNDS TO FORM THERMOSETTING RESINS; HEAT RESISTANCE NIPPON SHOKUBAI KAGAKU KOGYO CO., LTD. (JP) 1989-06-06 US disclosed
EP-0281365-A2 Curable compositions NIPPON OIL CO. LTD. (JP) 1988-09-07 EP disclosed