Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FDPS | P14324 | 1/20 | 0.44 |
| ▸ | CYP19A1 | P11511 | 4/20 | 0.41 |
| ▸ | CYP11B1 | P15538 | 4/20 | 0.41 |
| ▸ | CYP11B2 | P19099 | 3/20 | 0.41 |
| ▸ | TBXAS1 | P24557 | 4/20 | 0.41 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.40 |
| ▸ | QPCT | Q16769 | 2/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9784117 | 0.82 | CYP19A1 (0.49) | CYP19A1QPCT | |
| SCHEMBL9784108 | 0.81 | CYP19A1 (0.40) | CYP19A1CYP11B1CYP11B2TBXAS1QPCT | |
| Thiocyanic Acid SCHEMBL28722833 | 0.79 | FDPS (0.43) | FDPSCYP19A1CYP11B1CYP11B2TBXAS1 | |
| SCHEMBL28867067 | 0.78 | FDPS (0.42) | FDPSCYP19A1CYP11B1CYP11B2TBXAS1 | |
| SCHEMBL9783632 | 0.78 | CYP11B1 (0.42) | CYP19A1CYP11B1CYP11B2TBXAS1QPCT | |
| SCHEMBL9783612 | 0.78 | CYP11B1 (0.42) | CYP19A1CYP11B1CYP11B2TBXAS1QPCT | |
| SCHEMBL171211 | 0.77 | — | — | |
| SCHEMBL27918074 | 0.76 | TBXAS1 (0.59) | TBXAS1 | |
| Hydrochloric Acid SCHEMBL28795927 | 0.75 | FDPS (0.50) | FDPSCYP19A1CYP11B1CYP11B2TBXAS1 | |
| Hydrochloric Acid SCHEMBL26696100 | 0.75 | FDPS (0.50) | FDPSCYP19A1CYP11B1CYP11B2TBXAS1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114410063-A | Heat-conducting and insulating epoxy resin composite material and preparation method thereof | 深圳烯湾科技有限公司 | 2022-04-29 | — | — | CN | claimed |
| CN-114410063-A | Heat-conducting and insulating epoxy resin composite material and preparation method thereof | 深圳烯湾科技有限公司 | 2022-04-29 | — | — | CN | disclosed |
| US-6174227-B1 | A POLISHING PAD WITH A SURFACE HAVING VICKERS HARDNESS OF 2.5 TO 40, COMPRISING AN EPOXY RESIN SELECTED FROM BISPHENOL A OR BISPHENOL F EPOXY RESIN, NOVOLAC EPOXY RESIN, DENATURED EPOXY RESIN, AROMATIC ANHYDRIDE OR AMINE OR IMIDAZOLE CURING AGENT | NIKON CORPORATION (JP) | 2001-01-16 | — | — | US | disclosed |