SCHEMBL7785935

SCHEMBL7785935

CCCCC(CC)CNCCCCCCNCC(CC)CCCC

nearest known ligand 0.75

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.75
TSHR P16473 5/20 0.75
CYP3A4 P08684 3/20 0.75
KDM4E B2RXH2 1/20 0.47
TDP1 Q9NUW8 1/20 0.46
ANPEP P15144 1/20 0.42
ERAP2 Q6P179 1/20 0.42
CA2 P00918 2/20 0.38
L3MBTL1 Q9Y468 1/20 0.38
LMNA P02545 3/20 0.38
USP2 O75604 3/20 0.38
MEN1 O00255 2/20 0.38
TP53 P04637 2/20 0.38
KMT2A Q03164 2/20 0.38
CYP1A2 P05177 1/20 0.38
CYP2D6 P10635 1/20 0.38
CYP2C9 P11712 1/20 0.38
CYP2C19 P33261 1/20 0.38
HIF1A Q16665 1/20 0.38
MAPK1 P28482 2/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2949453 0.98 ALDH1A1 (0.72) ALDH1A1TSHRCYP3A4KDM4ETDP1
SCHEMBL26034630 0.98 ALDH1A1 (0.72) ALDH1A1TSHRCYP3A4KDM4ETDP1
SCHEMBL9174256 0.98 ALDH1A1 (0.72) ALDH1A1TSHRCYP3A4KDM4ETDP1
SCHEMBL9204886 0.98 ALDH1A1 (0.72) ALDH1A1TSHRCYP3A4KDM4ETDP1
SCHEMBL28697359 0.98 ALDH1A1 (0.72) ALDH1A1TSHRCYP3A4KDM4ETDP1
SCHEMBL11663392 0.98 ALDH1A1 (0.72) ALDH1A1TSHRCYP3A4KDM4ETDP1
SCHEMBL20627942 0.94 ALDH1A1 (0.65) ALDH1A1TSHRCYP3A4KDM4ETDP1
SCHEMBL11660748 0.94 ALDH1A1 (0.65) ALDH1A1TSHRCYP3A4KDM4ETDP1
SCHEMBL11663393 0.94 ALDH1A1 (0.65) ALDH1A1TSHRCYP3A4KDM4ETDP1
SCHEMBL2404148 0.93 TSHR (0.78) ALDH1A1TSHRCYP3A4KDM4ETDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20170183444-A1 CURING AGENTS FOR LOW-EMISSION EPOXY RESIN PRODUCTS SIKA TECHNOLOGY AG (CH) 2017-06-29 US disclosed
US-9631047-B2 Curing agents for low-emission epoxy resin products SIKA TECHNOLOGY AG (CH) 2017-04-25 US disclosed
EP-2943519-B1 HARDENERS FOR LOW-EMISSION EPOXY RESIN PRODUCTS SIKA TECHNOLOGY AG (CH) 2016-11-02 EP disclosed
US-20150337076-A1 CURING AGENTS FOR LOW-EMISSION EXPOXY RESIN PRODUCTS SIKA TECHNOLOGY AG (CH) 2015-11-26 US disclosed
EP-2943519-A2 HARDENERS FOR LOW-EMISSION EPOXY RESIN PRODUCTS Sika Technology AG (CH) 2015-11-18 EP disclosed
WO-2014108305-A2 HARDENERS FOR LOW-EMISSION EPOXY RESIN PRODUCTS SIKA TECHNOLOGY AG (CH) 2014-07-17 WO disclosed
EP-2752437-A1 Hardener for low emission epoxy resin products Sika Technology AG (CH) 2014-07-09 EP disclosed
EP-1147158-A1 CATIONIC GEMINI AND RELATED MULTIPLE HYDROPHILIC/HYDROPHOBIC FUNCTIONAL COMPOUNDS AND THEIR USE AS SURFACTANTS Akzo Nobel N.V. (NL) 2001-10-24 EP disclosed
WO-2000039241-A1 CATIONIC GEMINI AND RELATED MULTIPLE HYDROPHILIC/HYDROPHOBIC FUNCTIONAL COMPOUNDS AND THEIR USE AS SURFACTANTS AKZO NOBEL N.V. (NL) 2000-07-06 WO disclosed