SCHEMBL7796862

SCHEMBL7796862

CCCCC(CO)=C(CO)CO

nearest known ligand 0.43

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
CES1 P23141 5/20 0.43
CES2 O00748 4/20 0.43
ALDH1A1 P00352 5/20 0.42
SMN1; SMN2 Q16637 1/20 0.40
TP53 P04637 1/20 0.39
TSHR P16473 4/20 0.38
LMNA P02545 3/20 0.38
HSD17B10 Q99714 1/20 0.38
MEN1 O00255 1/20 0.38
KMT2A Q03164 1/20 0.38
CA1 P00915 1/20 0.38
AKR1B1 P15121 1/20 0.33
THRB P10828 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7796669 0.91 CES2 (0.46) CES1CES2ALDH1A1SMN1; SMN2TSHR
SCHEMBL7799475 0.88 CES2 (0.48) CES1CES2ALDH1A1TSHRLMNA
SCHEMBL7799457 0.88 CES2 (0.48) CES1CES2ALDH1A1TSHRLMNA
SCHEMBL7799468 0.88 CES2 (0.48) CES1CES2ALDH1A1TSHRLMNA
SCHEMBL7796843 0.88 CES2 (0.48) CES1CES2ALDH1A1TSHRLMNA
SCHEMBL7800661 0.88 CES2 (0.48) CES1CES2ALDH1A1TSHRLMNA
SCHEMBL7799476 0.88 CES2 (0.48) CES1CES2ALDH1A1TSHRLMNA
SCHEMBL19858906 0.88 CES2 (0.48) CES1CES2ALDH1A1TSHRLMNA
SCHEMBL8211525 0.85 TSHR (0.50) CES1CES2ALDH1A1TSHRLMNA
SCHEMBL8211533 0.85 TSHR (0.50) CES1CES2ALDH1A1TSHRLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025089080-A1 RESIN COMPOSITION, HEAT DISSIPATION DEVICE, AND ELECTRONIC DEVICE AGC株式会社 2025-05-01 WO disclosed
WO-2025089079-A1 RESIN COMPOSITION, ELECTROMAGNETIC-WAVE SHIELDING BODY, AND ELECTRONIC DEVICE AGC株式会社 2025-05-01 WO disclosed
WO-2024038859-A1 ADHESIVE RESIN COMPOSITION, CURED PRODUCT AND LAMINATE artience株式会社 2024-02-22 WO disclosed
WO-2022071514-A1 ADHESIVE, CURED PRODUCT, AND LAMINATE 東洋インキSCホールディングス株式会社 2022-04-07 WO disclosed
US-11130890-B2 Adhesive composition, adhesive sheet, and method for producing same TOYO INK SC HOLDINGS CO., LTD. (JP) 2021-09-28 US disclosed
CN-107207929-B Adhesive composition, adhesive sheet, and method for producing same 东洋油墨SC控股株式会社 2020-03-06 CN disclosed
US-20180044562-A1 ADHESIVE COMPOSITION, ADHESIVE SHEET, AND METHOD FOR PRODUCING SAME TOYO INK SC HOLDINGS CO., LTD. (JP) 2018-02-15 US disclosed
EP-1160259-A1 RESIN FOR PRINTING INK AND PRINTING INK TOYO INK MFG. CO., LTD. (JP) 2001-12-05 EP disclosed