SCHEMBL780494

SCHEMBL780494

C=C(C(=O)O)C(C)C1(C)COC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10455458 0.92
SCHEMBL782172 0.76
SCHEMBL3374502 0.76
SCHEMBL3378253 0.74 CHRM1 (0.32)
SCHEMBL3378705 0.73
Oxalic Acid SCHEMBL30392002 0.71 SLC7A5 (0.31)
SCHEMBL3379280 0.71 ALDH1A1 (0.38)
SCHEMBL17420847 0.71
SCHEMBL865424 0.71
SCHEMBL31537157 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8298743-B2 Positive-type photosensitive composition, transparent conductive film, display element and integrated solar battery FUJIFILM CORPORATION (JP) 2012-10-30 US claimed
US-12443101-B2 Cured coating film TAIYO HOLDINGS CO., LTD. (JP) 2025-10-14 US disclosed
US-12313973-B2 Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing same LG CHEM, LTD. (KR) 2025-05-27 US disclosed
EP-4502077-A1 CURED PRODUCT, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PRINTED WIRING BOARD TAIYO HOLDINGS CO., LTD. (JP) 2025-02-05 EP disclosed
US-12043754-B2 Two-component type curable resin composition, product, dry film, cured product, and printed wiring board TAIYO HOLDINGS CO., LTD. (JP) 2024-07-23 US disclosed
EP-3569662-B1 ANTIMICROBIAL POLYMER COATING COMPOSITION AND ANTIMICROBIAL POLYMER FILM LG CHEMICAL LTD (KR) 2022-12-28 EP disclosed
US-20220390844-A1 CURED COATING FILM TAIYO INK MFG. CO., LTD. (JP) 2022-12-08 US disclosed
US-20220325126-A1 INSULATING FILM FOR ELECTRONIC COMPONENTS AND METHOD OF PRODUCING INSULATING FILM FOR ELECTRONIC COMPONENTS TAIYO INK MFG. CO., LTD. (JP) 2022-10-13 US disclosed
US-20220325128-A1 TWO-COMPONENT TYPE CURABLE RESIN COMPOSITION, PRODUCT, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD TAIYO INK MFG. CO., LTD. (JP) 2022-10-13 US disclosed
US-20220279663-A1 INSULATING LAYER FOR MULTILAYER PRINTED CIRCUIT BOARD, MULTILAYER PRINTED CIRCUIT BOARD COMPRISING SAME, AND METHOD FOR PRODUCING SAME LG CHEM, LTD. (KR) 2022-09-01 US disclosed
US-7670745-B2 Alkali soluble polymer and positive working photosensitive resin composition using the same CHISSO CORPORATION (JP) 2010-03-02 US disclosed
US-20090311624-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION CONTAINING LIQUID ADDITIVE NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2009-12-17 US disclosed
US-7585570-B2 A curable adhesive comprising acrylic ester polymers, a polysilsesquioxane or polysilicate, and a disisocyanate crosslinking agent; liquid crystal displays; glass substrates; films; durability; antipeeling agents; haze-free, nonblistering; antifoam agents; resistant to repeated cycles of heating/cooling SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2009-09-08 US disclosed
US-20080131813-A1 Alkali soluble polymer and positive working photosensitive resin composition using the same CHISSO CORPORATION 2008-06-05 US disclosed
US-7226721-B2 Underlayer coating forming composition for lithography containing compound having protected carboxyl group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2007-06-05 US disclosed
US-20060252863-A1 A curable adhesive comprising acrylic ester polymers, a polysilsesquioxane or polysilicate, and a disisocyanate crosslinking agent; liquid crystal displays; glass substrates; films; durability; antipeeling agents; haze-free, nonblistering; antifoam agents; resistant to repeated cycles of heating/cooling SUMITOMO CHEMICHAL COMPANY, LIMITED 2006-11-09 US disclosed
US-20060210915-A1 Composition for forming lower layer film for lithography comprising compound having protected carboxyl group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2006-09-21 US disclosed
EP-1662769-A1 COMPOSITION FOR FORMING LOWER LAYER FILM FOR LITHOGRAPHY COMPRISING COMPOUND HAVING PROTECTED CARBOXYL GROUP Nissan Chemical Industries, Ltd. (JP) 2006-05-31 EP disclosed
WO-2006004171-A1 PHOTOSENSITIVE FILM, PROCESS FOR PRODUCING THE SAME, PROCESS FOR FORMING PERMANENT PATTERN FUJI PHOTO FILM CO., LTD. (JP) 2006-01-12 WO disclosed
WO-2005093793-A1 PROCESS FOR FORMING PERMANENT PATTERN FUJI PHOTO FILM CO., LTD. (JP) 2005-10-06 WO disclosed