SCHEMBL7809667

SCHEMBL7809667

Oc1ccccc1Cc1ccccc1Cc1ccccc1O

nearest known ligand 0.94

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSPA5 P11021 1/20 0.94
KEAP1 Q14145 1/20 0.62
HIF1A Q16665 2/20 0.56
TSHR P16473 2/20 0.56
CYP2D6 P10635 1/20 0.56
TAAR1 Q96RJ0 1/20 0.54
AKR1B1 P15121 1/20 0.54
CA12 O43570 7/20 0.52
CA2 P00918 7/20 0.52
IDO1 P14902 2/20 0.52
CA9 Q16790 5/20 0.50
KDM4E B2RXH2 2/20 0.50
HSD17B10 Q99714 2/20 0.50
MPO P05164 2/20 0.50
NPC1 O15118 1/20 0.50
GMNN O75496 1/20 0.50
ALDH1A1 P00352 1/20 0.50
EGFR P00533 1/20 0.50
LMNA P02545 1/20 0.50
FYN P06241 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5852726 1.00 HSPA5 (0.94) HSPA5KEAP1HIF1ATSHRCYP2D6
SCHEMBL49745 0.97 HSPA5 (1.00) HSPA5KEAP1HIF1ATSHRCYP2D6
SCHEMBL29357407 0.97 HSPA5 (1.00) HSPA5KEAP1HIF1ATSHRCYP2D6
SCHEMBL29839938 0.94 HSPA5 (0.94) HSPA5KEAP1HIF1ATSHRCYP2D6
Ammonia Solution, Strong SCHEMBL28323965 0.94 HSPA5 (0.94) HSPA5KEAP1HIF1ATSHRCYP2D6
Ethylene Glycol SCHEMBL28140490 0.89 HSPA5 (0.84) HSPA5KEAP1HIF1ATSHRCYP2D6
SCHEMBL1841573 0.88 HSPA5 (0.73) HSPA5KEAP1HIF1ATSHRCYP2D6
SCHEMBL27936056 0.88 HSPA5 (0.73) HSPA5KEAP1HIF1ATSHRCYP2D6
SCHEMBL30874252 0.87 HSPA5 (0.80) HSPA5KEAP1HIF1ATSHRCYP2D6
SCHEMBL8926581 0.87 HSPA5 (0.80) HSPA5KEAP1HIF1ATSHRCYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-7196568-A None JP disclosed
CN-114805801-A Cyanate ester resin with low hygroscopicity and preparation method thereof 黑龙江省科学院石油化学研究院 2022-07-29 CN disclosed
US-6316170-B2 COATING, EXPOSURE, DEVELOPMENT AND HEAT TREATMENT KABUSHIKI KAISHA TOSHIBA (JP) 2001-11-13 US disclosed
US-20010006767-A1 Developing solution and method of forming polyimide pattern by using the developing solution YOSHIAKI KAWAMONZEN 2001-07-05 US disclosed
JP-H07196568-A BIS(HYDROXYBENZYL)BENZENE COMPOUND, ITS EPOXY RESIN AND THEIR PRODUCTION MITSUI TOATSU CHEM INC 1995-08-01 JP disclosed