Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DNM1 | Q05193 | 9/20 | 0.42 |
| ▸ | CA12 | O43570 | 2/20 | 0.42 |
| ▸ | CA1 | P00915 | 2/20 | 0.42 |
| ▸ | CA2 | P00918 | 2/20 | 0.42 |
| ▸ | CA3 | P07451 | 2/20 | 0.42 |
| ▸ | CA4 | P22748 | 2/20 | 0.42 |
| ▸ | CA6 | P23280 | 2/20 | 0.42 |
| ▸ | CA5A | P35218 | 2/20 | 0.42 |
| ▸ | CA7 | P43166 | 2/20 | 0.42 |
| ▸ | CA9 | Q16790 | 2/20 | 0.42 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.42 |
| ▸ | CA5B | Q9Y2D0 | 2/20 | 0.42 |
| ▸ | TSHR | P16473 | 2/20 | 0.42 |
| ▸ | LMNA | P02545 | 1/20 | 0.42 |
| ▸ | BLM | P54132 | 1/20 | 0.42 |
| ▸ | MEN1 | O00255 | 1/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.39 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7808183 | 1.00 | DNM1 (0.42) | DNM1CA12CA1CA2CA3 | |
| SCHEMBL7799177 | 1.00 | DNM1 (0.42) | DNM1CA12CA1CA2CA3 | |
| SCHEMBL7545455 | 1.00 | DNM1 (0.42) | DNM1CA12CA1CA2CA3 | |
| SCHEMBL7799125 | 1.00 | DNM1 (0.42) | DNM1CA12CA1CA2CA3 | |
| SCHEMBL202975 | 0.97 | NFKB1 (0.39) | DNM1CA12CA1CA2CA3 | |
| Putrescine SCHEMBL6283577 | 0.92 | NFKB1 (0.39) | DNM1CA12CA1CA2CA3 | |
| SCHEMBL24929117 | 0.90 | DNM1 (0.38) | DNM1CA12CA1CA2CA3 | |
| SCHEMBL9021278 | 0.90 | NFKB1 (0.33) | DNM1CA12CA1CA2CA3 | |
| SCHEMBL18098101 | 0.90 | DNM1 (0.38) | DNM1CA12CA1CA2CA3 | |
| SCHEMBL13647425 | 0.90 | NFKB1 (0.33) | DNM1CA12CA1CA2CA3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12319814-B2 | Polyamideimide resin, resin composition, and semiconductor device | RESONAC CORPORATION (JP) | 2025-06-03 | — | — | US | disclosed |
| EP-4365237-A1 | RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Resonac Corporation (JP) | 2024-05-08 | — | — | EP | disclosed |
| EP-4303250-A1 | POLY(AMIDE-IMIDE) RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | Resonac Corporation (JP) | 2024-01-10 | — | — | EP | disclosed |
| EP-4026867-B1 | POLYAMIDEIMIDE RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | RESONAC CORP (JP) | 2023-12-06 | — | — | EP | disclosed |
| WO-2023277134-A1 | RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2023-01-05 | — | — | WO | disclosed |
| WO-2023276093-A1 | RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2023-01-05 | — | — | WO | disclosed |
| US-20220332947-A1 | POLYAMIDEIMIDE RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2022-10-20 | — | — | US | disclosed |
| WO-2022185718-A1 | POLY(AMIDE-IMIDE) RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-09-09 | — | — | WO | disclosed |
| EP-4026867-A1 | POLYAMIDE IMIDE RESIN, RESIN COMPOSITION AND SEMICONDUCTOR DEVICE | Showa Denko Materials Co., Ltd. (JP) | 2022-07-13 | — | — | EP | disclosed |
| US-6316170-B2 | COATING, EXPOSURE, DEVELOPMENT AND HEAT TREATMENT | KABUSHIKI KAISHA TOSHIBA (JP) | 2001-11-13 | — | — | US | disclosed |
| US-20010006767-A1 | Developing solution and method of forming polyimide pattern by using the developing solution | YOSHIAKI KAWAMONZEN | 2001-07-05 | — | — | US | disclosed |
| US-6183934-B1 | FOE USE IN FORMATION OF PATTERN OF INSULATION FILM, PASSIVATION FILM, .ALPHA.-RAY SHIELDING FILM, OPTICAL WAVEGUIDE | KABUSHIKI KAISHA TOSHIBA (JP) | 2001-02-06 | — | — | US | disclosed |
| US-6159654-A | Negative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heating | KABUSHIKI KAISHA TOSHIBA (JP) | 2000-12-12 | — | — | US | disclosed |
| US-6001517-A | A THERMOSETTING POLYMER WHICH CAN BE CURED THROUGH CYCLODEHYDRATION UPON HEATING AND A CURE ACCELERATOR WHICH CAN BE DEACTIVATED OF ITS CURE ACCELERATION PROPERTY BY IRRIDIATION OF LIGHT | KABUSHIKI KAISHA TOSHIBA (JP) | 1999-12-14 | — | — | US | disclosed |
| US-5756650-A | COMPOSITION COMPRISING POLYAMIC ACID, CURE ACCELERATOR SELECTED FROM GROUP CONSISTING OF NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AMINO ACID COMPOUND, AROMATIC COMPOUND HAVING TWO OR MORE HYDROXYL GROUPS | KABUSHIKI KAISHA TOSHIBA (JP) | 1998-05-26 | — | — | US | disclosed |
| US-5578697-A | DIELECTRIC POLYMERS FOR ELECTRONICS | KABUSHIKI KAISHA TOSHIBA (JP) | 1996-11-26 | — | — | US | disclosed |