SCHEMBL7870381

SCHEMBL7870381

Cc1cccc(Nn2cccc2)c1

nearest known ligand 0.50

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 3/20 0.50
MAPT P10636 3/20 0.50
CYP3A4 P08684 2/20 0.50
CYP2C19 P33261 2/20 0.50
CYP2D6 P10635 1/20 0.50
CYP2C9 P11712 1/20 0.50
HTT P42858 1/20 0.50
NPSR1 Q6W5P4 1/20 0.50
HSD17B10 Q99714 1/20 0.46
GAA P10253 2/20 0.44
ACHE P22303 1/20 0.44
ALDH1A1 P00352 4/20 0.42
MEN1 O00255 2/20 0.42
KMT2A Q03164 2/20 0.42
RXFP1 Q9HBX9 1/20 0.42
NFKB1 P19838 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
RAB9A P51151 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7075844 0.78 CYP11B1 (0.46) CYP1A2MAPTCYP3A4CYP2C19CYP2D6
SCHEMBL11548995 0.75 CYP3A4 (0.50) CYP1A2MAPTCYP3A4CYP2C19CYP2D6
SCHEMBL626632 0.72 ALDH1A1 (0.43) CYP1A2MAPTCYP3A4CYP2C19CYP2D6
SCHEMBL29650380 0.72 NPSR1 (0.86) CYP1A2MAPTCYP3A4CYP2C19CYP2D6
SCHEMBL6694995 0.72 GAA (0.65) CYP1A2MAPTCYP3A4CYP2C19CYP2D6
SCHEMBL1009206 0.72 NPSR1 (0.86) CYP1A2MAPTCYP3A4CYP2C19CYP2D6
SCHEMBL11413768 0.71 PDE5A (0.34) CYP1A2HSD17B10ALDH1A1
SCHEMBL12704573 0.71 XPO1 (0.49) CYP1A2MAPTCYP3A4CYP2C19CYP2D6
SCHEMBL8716665 0.71 UHRF1 (0.42)
SCHEMBL29697291 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105986253-B The plating application and its manufacturing method of excellent adhesion 阿基里斯株式会社 2019-09-27 CN disclosed
CN-103460320-B The manufacture method of electroconductive polymer dispersion soln and electrolysis condenser 松下知识产权经营株式会社 2016-10-19 CN disclosed
US-9466432-B2 Process for producing solution having electrically conductive polymer dispersed therein, and electrolytic capacitor PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2016-10-11 US disclosed
CN-105986253-A Plated material with excellent marginal sealing performance and manufacturing method thereof 阿基里斯株式会社 2016-10-05 CN disclosed
US-9401245-B2 2016-07-26 US disclosed
CN-103124635-B Method for producing resin sheet having decorative film layer and metal film layer SAKAIYA CO LTD 2015-07-08 CN disclosed
US-20140170405-A1 PROCESSES FOR PREPARING CURED FILMS, THE RESULTING FILMS, AND PLASMA-INITIATED POLYMERIZABLE COMPOSITIONS FUJIFILM CORPORATION (JP) 2014-06-19 US disclosed
EP-0261837-B1 Process for the preparation of electrically conductive material SANYO ELECTRIC CO (JP) 2001-07-11 EP disclosed
EP-0261837-A2 Electrically conductive material and a process for the preparation of same and secondary battery using the electrically conductive material Sanyo Electric Co., Ltd (JP) 1988-03-30 EP disclosed