SCHEMBL7902014

SCHEMBL7902014

O=C(Cl)OC1CC=CCC1

nearest known ligand 0.32

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.32
TP53 P04637 1/20 0.32
TSHR P16473 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
ALDH1A1 P00352 5/20 0.31
ALOX15 P16050 2/20 0.31
MEN1 O00255 1/20 0.31
MAPT P10636 1/20 0.31
HTT P42858 1/20 0.31
KMT2A Q03164 1/20 0.31
ESR2 Q92731 1/20 0.31
HSD17B10 Q99714 1/20 0.31
KDM4E B2RXH2 2/20 0.31
POLB P06746 1/20 0.31
GAA P10253 1/20 0.31
TDP1 Q9NUW8 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11350022 0.89 EPHX1 (0.33) SMN1; SMN2
SCHEMBL3682123 0.84
SCHEMBL4754739 0.83 LMNA (0.37) LMNATP53TSHRSMN1; SMN2ALDH1A1
SCHEMBL9657499 0.81 LMNA (0.33) LMNATP53TSHRSMN1; SMN2ALDH1A1
SCHEMBL28115386 0.79 TSHR (0.35) LMNATP53TSHRSMN1; SMN2ALDH1A1
SCHEMBL7640695 0.79 TSHR (0.35) LMNATP53TSHRSMN1; SMN2ALDH1A1
SCHEMBL11357195 0.79 LMNA (0.32) LMNATP53TSHRSMN1; SMN2ALDH1A1
SCHEMBL28114860 0.79 TSHR (0.35) LMNATP53TSHRSMN1; SMN2ALDH1A1
SCHEMBL1061665 0.76 MIF (0.43) LMNATP53TSHRSMN1; SMN2ALDH1A1
SCHEMBL5430000 0.76 SMN1; SMN2 (0.40) LMNATP53TSHRSMN1; SMN2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6197122-B1 THERMALLY DECOMPOSING ENCAPSULATION AND UNDERFILL TO PROVIDE RESIDUE ON ELECTRONIC COMPONENTS AND DISSOLVING RESIDUE IN POLAR OR BASIC SOLVENT TO EXPOSE ELECTRONIC COMPONENTS CORNELL RESEARCH FOUNDATION, INC. 2001-03-06 US disclosed
US-5973033-A CURED THERMOSETS FOR ENCAPSULATION AND UNDERFILL FOR ELECTRONIC COMPONENTS THAT ARE THERMALLY DECOMPOSABLE TO ALLOW REPAIR, REPLACEMENT, RECOVERY OR RECYCLING OF OPERATIVE ELECTRONIC COMPONENTS CORNELL RESEARCH FOUNDATION, INC. (US) 1999-10-26 US disclosed
US-5948922-A CROSSLINKING THERMOSETTING RESINS CORNELL RESEARCH FOUNDATION, INC. (US) 1999-09-07 US disclosed
EP-0004529-B1 TANTOMERIC ARYLAMINOIMIDAZOLINE DERIVATIVES, THEIR PREPARATION AND PHARMACEUTICAL FORMULATIONS FOR ANALGETIC APPLICATION CONTAINING THEM Lentia Gesellschaft mit beschränkter Haftung (DE) 1981-06-17 EP disclosed
EP-0004529-A2 Tantomeric arylaminoimidazoline derivatives, their preparation and pharmaceutical formulations for analgetic application containing them Lentia Gesellschaft mit beschränkter Haftung (DE) 1979-10-17 EP disclosed