SCHEMBL7902121

SCHEMBL7902121

CC=CC(=O)OCC(C)OC(=O)CC(C)=O

nearest known ligand 0.37

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.37
MGAM O43451 1/20 0.35
GAA P10253 1/20 0.35
SI P14410 1/20 0.35
MGAM2 Q2M2H8 1/20 0.35
ALDH1A1 P00352 1/20 0.31
HPGD P15428 1/20 0.31
GSTP1 P09211 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7902118 1.00 TSHR (0.37) TSHRMGAMGAASIMGAM2
SCHEMBL28034880 0.84 FAAH (0.33) MGAMGAASIMGAM2GSTP1
SCHEMBL9715024 0.83 TSHR (0.44) TSHRALDH1A1HPGDGSTP1
SCHEMBL21636779 0.83 TSHR (0.44) TSHRALDH1A1HPGDGSTP1
SCHEMBL271472 0.82 TSHR (0.59) TSHRMGAMGAASIMGAM2
SCHEMBL28822651 0.81 ALDH1A1 (0.33) MGAMGAASIMGAM2ALDH1A1
SCHEMBL2702684 0.81 MGAM (0.44) TSHRMGAMGAASIMGAM2
SCHEMBL25381600 0.80 MGAM (0.30) MGAMGAASIMGAM2
SCHEMBL1532821 0.78 MGAM (0.39) MGAMGAASIMGAM2
SCHEMBL27650752 0.77 TSHR (0.56) TSHRALDH1A1HPGDGSTP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4737493-A1 MODIFIED POLYOLEFIN RESIN COMPOSITION AND USE FOR SAID RESIN COMPOSITION TOYOBO MC Corporation (JP) 2026-05-06 EP disclosed
EP-4663666-A1 MODIFIED POLYOLEFIN RESIN COMPOSITION AND USE FOR SAID RESIN COMPOSITION TOYOBO MC Corporation (JP) 2025-12-17 EP disclosed
WO-2025004895-A1 MODIFIED POLYOLEFIN RESIN COMPOSITION AND USE FOR SAID RESIN COMPOSITION 東洋紡エムシー株式会社 2025-01-02 WO disclosed
WO-2024166764-A1 MODIFIED POLYOLEFIN RESIN COMPOSITION AND USE FOR SAID RESIN COMPOSITION 東洋紡エムシー株式会社 2024-08-15 WO disclosed
CN-105008483-A Sheet-adhesive resin composition, laminate, protective sheet for solar cell, and module for solar cell TOYO INK SC HOLDINGS CO LTD 2015-10-28 CN disclosed
EP-2725076-A1 TWO-COMPONENT HYDROLYSIS-TYPE ANTIFOULING PAINT COMPOSITION, ANTIFOULING COATING FILM, AND METHOD FOR PRODUCING ANTIFOULING SUBSTRATE Chugoku Marine Paints, Ltd. (JP) 2014-04-30 EP disclosed
US-6197907-B1 LOW MOLECULAR WEIGHT HAVING A VERY LITTLE ODOR IS PRODUCED BY EMULSION-POLYMERIZING A RADICAL-POLYMERIZABLE UNSATURATED MONOMER AT A TEMPERATURE OF 115 DEGREES C. OR HIGHER IN THE PRESENCE OR ABSENCE OF A CHAIN TRANSFER AGENT. NIPPON CARBIDE KOGYO KABUSHIKI KAISHA (JP) 2001-03-06 US disclosed
EP-0931795-A1 POLYMER OBTAINED BY EMULSION POLYMERIZATION METHOD NIPPON CARBIDE KOGYO KABUSHIKI KAISHA (JP) 1999-07-28 EP disclosed