SCHEMBL7915760

SCHEMBL7915760

CCCCC(=O)CC(=O)OCCC

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FAAH O00519 2/20 0.55
DGKA P23743 1/20 0.50
NAAA Q02083 1/20 0.45
HTR2C P28335 1/20 0.44
HAO1 Q9UJM8 1/20 0.42
DNM1 Q05193 1/20 0.42
CES2 O00748 1/20 0.41
CES1 P23141 1/20 0.41
ALDH1A1 P00352 2/20 0.40
ACHE P22303 2/20 0.39
MGAM O43451 1/20 0.39
GAA P10253 1/20 0.39
SI P14410 1/20 0.39
MGAM2 Q2M2H8 1/20 0.39
EPHX2 P34913 1/20 0.39
RAD52 P43351 1/20 0.39
NPSR1 Q6W5P4 1/20 0.39
EPHX1 P07099 1/20 0.38
TP53 P04637 1/20 0.38
MAPT P10636 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28612435 0.94 DGKA (0.59) FAAHDGKANAAAHTR2CHAO1
SCHEMBL1905421 0.92 DGKA (0.62) FAAHDGKANAAAHTR2CHAO1
SCHEMBL7916105 0.92 FAAH (0.59) FAAHDGKANAAAHTR2CHAO1
SCHEMBL7914174 0.88 FAAH (0.71) FAAHDGKANAAAHTR2CHAO1
SCHEMBL6831476 0.87 FAAH (0.48) FAAHDGKANAAAHTR2CDNM1
SCHEMBL21794094 0.86 TSHR (0.48) FAAHDGKAALDH1A1MAPTKMT2A
SCHEMBL9068981 0.86 TSHR (0.50) FAAHDGKAHAO1DNM1ALDH1A1
SCHEMBL28609968 0.86 FAAH (0.62) FAAHDGKANAAAHTR2CHAO1
SCHEMBL11569429 0.86 FAAH (0.68) FAAHDGKANAAAHTR2CHAO1
SCHEMBL2591765 0.85 FAAH (0.47) FAAHDGKANAAAHTR2CDNM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106661395-B Workpiece fixing sheet with resin layer 琳得科株式会社 2021-05-28 CN disclosed
US-6207739-B1 Polyamide acid composition containing metal, polyimide film, flexible printed wiring board and method for producing them KANEGAFUCHI KAGAKU KOGYO KABUSHIKI (JP) 2001-03-27 US disclosed
EP-0114059-B1 METHOD OF PREPARING A POLYAMIDE ACID COMPOSITION FOR PREPARING POLYIMIDE KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1989-06-14 EP disclosed
EP-0083690-B1 POLYAMIDE ACID COMPOSITION FOR PREPARING POLYIMIDE AND PROCESS FOR PREPARING POLYIMIDE FROM THE SAME KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1986-03-12 EP disclosed
US-4515915-A Polyamide acid composition for preparing polyimide KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1985-05-07 US disclosed
EP-0114059-A2 Method of preparing a polyamide acid composition for preparing polyimide KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1984-07-25 EP disclosed
US-4454276-A POT LIFE EXTENDING AGENT Kanegafuchi Chkagaku Kogyo Kabushiki Kaisha (JP) 1984-06-12 US disclosed
EP-0083690-A1 Polyamide acid composition for preparing polyimide and process for preparing polyimide from the same KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1983-07-20 EP disclosed