SCHEMBL7921656

SCHEMBL7921656

CC(C)(c1ccc(N)cc1)c1cccc(Oc2ccc(C(=O)c3ccc(Oc4cccc(C(C)(C)c5ccc(N)cc5)c4)cc3)cc2)c1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 3/20 0.49
▸ MAPT P10636 3/20 0.49
▸ SMN1; SMN2 Q16637 2/20 0.49
▸ MEN1 O00255 2/20 0.49
▸ KMT2A Q03164 2/20 0.49
▸ MITF O75030 1/20 0.49
▸ GAA P10253 1/20 0.49
▸ GFER P55789 1/20 0.49
▸ NLRP1 Q9C000 1/20 0.49
▸ NOD2 Q9HC29 1/20 0.49
▸ NPC1 O15118 3/20 0.46
▸ RAB9A P51151 3/20 0.46
▸ HPGD P15428 1/20 0.46
▸ MAPK1 P28482 1/20 0.46
▸ PARP10 Q53GL7 2/20 0.45
▸ POLB P06746 2/20 0.45
▸ CYP2C9 P11712 1/20 0.45
▸ TNKS O95271 1/20 0.44
▸ PARP15 Q460N3 1/20 0.44
▸ PARP14 Q460N5 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14354267 0.95 MAPT (0.49) ALDH1A1MAPTSMN1; SMN2MEN1KMT2A
SCHEMBL8918305 0.91 NPC1 (0.46) ALDH1A1MAPTSMN1; SMN2MEN1KMT2A
SCHEMBL9101698 0.91 PARP10 (0.46) ALDH1A1MAPTSMN1; SMN2MEN1KMT2A
SCHEMBL26764175 0.89 ALDH1A1 (0.58) ALDH1A1MAPTSMN1; SMN2KMT2ANPC1
SCHEMBL26840191 0.89 ALDH1A1 (0.58) ALDH1A1MAPTSMN1; SMN2KMT2ANPC1
SCHEMBL202252 0.89 ALDH1A1 (0.58) ALDH1A1MAPTSMN1; SMN2KMT2ANPC1
SCHEMBL28889574 0.89 ALDH1A1 (0.58) ALDH1A1MAPTSMN1; SMN2KMT2ANPC1
SCHEMBL30933053 0.86 ALDH1A1 (0.66) ALDH1A1MAPTSMN1; SMN2MEN1KMT2A
SCHEMBL312282 0.86 ALDH1A1 (0.66) ALDH1A1MAPTSMN1; SMN2MEN1KMT2A
SCHEMBL29436314 0.86 ALDH1A1 (0.66) ALDH1A1MAPTSMN1; SMN2MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6184337-B1 HEAT RESISTANCE; FOR USE IN SEMICONDUCTORS TOMOEGAWA PAPER CO., LTD. (JP) 2001-02-06 — — US disclosed
US-5696235-A CONTAINING A BISMALEIMIDE; HEAT RESISTANCE, PROCESSABILITY; SOLUBLE IN VARIOUS ORGANIC SOLVENTS TOMOEGAWA PAPER CO., LTD. (JP) 1997-12-09 — — US disclosed
EP-0729996-A1 Polyimide and process for producing the same TOMOEGAWA PAPER CO. LTD. (JP) 1996-09-04 — — EP disclosed
EP-0553612-B1 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides HITACHI CHEMICAL CO LTD (JP) 1996-08-21 — — EP disclosed
EP-0456515-B1 Polyimides and thermosetting resin compositions containing the same HITACHI CHEMICAL CO LTD (JP) 1995-11-08 — — EP disclosed
EP-0456515-A1 Polyimides and thermosetting resin compositions containing the same Hitachi Chemical Co., Ltd. (JP) 1991-11-13 — — EP disclosed
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