Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | AOC3 | Q16853 | 1/20 | 0.44 |
| ▸ | ACHE | P22303 | 6/20 | 0.42 |
| ▸ | ACP3 | P15309 | 1/20 | 0.40 |
| ▸ | FFAR1 | O14842 | 1/20 | 0.39 |
| ▸ | BCHE | P06276 | 2/20 | 0.38 |
| ▸ | PTGS2 | P35354 | 2/20 | 0.38 |
| ▸ | IDO1 | P14902 | 2/20 | 0.37 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.35 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11199951 | 0.86 | AOC3 (0.42) | AOC3ACHEACP3IDO1CYP19A1 | |
| SCHEMBL23361825 | 0.82 | AOC3 (0.40) | AOC3ACHEACP3CYP19A1 | |
| SCHEMBL23361606 | 0.81 | AOC3 (0.45) | AOC3ACHEACP3IDO1CYP19A1 | |
| SCHEMBL6155751 | 0.78 | AOC3 (0.45) | AOC3ACP3FFAR1 | |
| SCHEMBL31175995 | 0.78 | IDO1 (0.43) | ACHEBCHEPTGS2IDO1ALDH1A1 | |
| SCHEMBL3871619 | 0.78 | CYP3A4 (0.48) | ACHEBCHEPTGS2ALDH1A1 | |
| SCHEMBL5377867 | 0.78 | HIF1A (0.49) | ACHEBCHEPTGS2ALDH1A1 | |
| SCHEMBL3141582 | 0.78 | IDO1 (0.43) | ACHEBCHEPTGS2IDO1ALDH1A1 | |
| SCHEMBL8309641 | 0.78 | PTGS2 (0.37) | ACHEBCHEPTGS2IDO1 | |
| SCHEMBL9891656 | 0.78 | PTGS2 (0.37) | ACHEFFAR1BCHEPTGS2ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118053799-A | Method for manufacturing semiconductor device | 株式会社力森诺科 | 2024-05-17 | — | — | CN | disclosed |
| CN-117157733-A | Method for manufacturing semiconductor device and dicing die-bonding integrated film | 株式会社力森诺科 | 2023-12-01 | — | — | CN | disclosed |
| CN-110945634-B | Heat-dissipating die bonding film and dicing die bonding film | 株式会社力森诺科 | 2023-08-29 | — | — | CN | disclosed |
| CN-112292431-B | Crystal cutting and crystal bonding integrated film and pressure-sensitive adhesive film used by same | 昭和电工材料株式会社 | 2022-09-02 | — | — | CN | disclosed |
| CN-114730706-A | Method for manufacturing semiconductor device, dicing die-bonding integrated film, and method for manufacturing the same | 昭和电工材料株式会社 | 2022-07-08 | — | — | CN | disclosed |
| CN-113348533-B | Method for evaluating pickup property, die-cut/die-bond integrated film, method for evaluating the same, method for sorting the same, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2022-06-03 | — | — | CN | disclosed |
| CN-113366621-B | Method for evaluating pickup property, die-cut and die-bond integrated film, method for evaluating die-cut and die-bond integrated film, method for sorting die-cut and die-bond integrated film, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2021-12-31 | — | — | CN | disclosed |
| CN-112219264-B | Die-cut/die-bond integrated film, method for producing same, and method for producing semiconductor device | 昭和电工材料株式会社 | 2021-12-03 | — | — | CN | disclosed |
| CN-113366621-A | Method for evaluating pickup property, die-cut and die-bond integrated film, method for evaluating die-cut and die-bond integrated film, method for sorting die-cut and die-bond integrated film, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2021-09-07 | — | — | CN | disclosed |
| CN-113348533-A | Method for evaluating pickup property, die-cut and die-bond integrated film, method for evaluating die-cut and die-bond integrated film, method for sorting die-cut and die-bond integrated film, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2021-09-03 | — | — | CN | disclosed |
| CN-1208418-C | Adhesive composition, method for producing same, adhesive film using same, substrate for mounting semiconductor, and semiconductor device | HITACHI CHEMICAL CO LTD (JP) | 2005-06-29 | — | — | CN | disclosed |
| CN-1156532-C | Epoxy-resin composition and use thereof | 三井化学株式会社 | 2004-07-07 | — | — | CN | disclosed |
| CN-1400993-A | Adhesive composition, method for producing same, adhesive film using same, substrate for mounting semiconductor, and semiconductor device | HITACHI CHEMICAL CO LTD (JP) | 2003-03-05 | — | — | CN | disclosed |
| CN-1346375-A | Sealing agent for liquid-crystal display, cell, composition for sealing agent for liquid-crystal display cell, and liquid-crystal display element | MITSUI CHEMICALS INC (JP) | 2002-04-24 | — | — | CN | disclosed |
| EP-1153952-A1 | SEALING AGENT FOR LIQUID-CRYSTAL DISPLAY CELL, COMPOSITION FOR SEALING AGENT FOR LIQUID-CRYSTAL DISPLAY CELL, AND LIQUID-CRYSTAL DISPLAY ELEMENT | Mitsui Chemicals, Inc. (JP) | 2001-11-14 | — | — | EP | disclosed |
| CN-1239116-A | Epoxy-resin composition and use thereof | MITSUI CHEMICALS INC (US) | 1999-12-22 | — | — | CN | disclosed |
| CN-1062544-A | The compositions of thermosetting resin that contains arylamino resin | MITSUI TOATSU CHEMICALS (JP) | 1992-07-08 | — | — | CN | disclosed |
| CN-1017055-B | Process for producing aromatic amine resin | MITSUI TOATSU CHEMICALS (JP) | 1992-06-17 | — | — | CN | disclosed |
| CN-1037721-A | Compositions of thermosetting resin | MITSUI TOATSU CHEMICALS (JP) | 1989-12-06 | — | — | CN | disclosed |
| CN-1032806-A | Aromatic amine resin, its preparation method and application in thermosetting resin composition | MITSUI TOATSU CHEMICALS (JP) | 1989-05-10 | — | — | CN | disclosed |