⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18628021 | 0.81 | ALDH1A1 (0.42) | — | |
| SCHEMBL501039 | 0.76 | — | — | |
| SCHEMBL4847780 | 0.76 | ALDH1A1 (0.38) | — | |
| SCHEMBL10966085 | 0.76 | ALDH1A1 (0.38) | — | |
| SCHEMBL20590363 | 0.76 | ALDH1A1 (0.38) | — | |
| SCHEMBL169924 | 0.74 | — | — | |
| SCHEMBL3062512 | 0.74 | — | — | |
| SCHEMBL9681397 | 0.74 | ALDH1A1 (0.36) | — | |
| SCHEMBL4016780 | 0.74 | — | — | |
| SCHEMBL25457615 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6225377-B1 | PRODUCING LATENTLY REACTIVE PREPOLYMER EPOXY RESIN MIXTURE POWDER | SIEMENS AKTIENGESELLSCHAFT (DE) | 2001-05-01 | — | — | US | claimed |
| EP-0650503-B1 | Process for the production of prepolymer epoxy resins with oxazolidinone structures | SIEMENS AG (DE) | 1997-12-29 | — | — | EP | claimed |
| EP-0650504-B1 | PROCESS FOR PRODUCING A FLAME-RESISTANT EPOXY RESIN MOLDING MATERIAL | SIEMENS AG (DE) | 1997-11-12 | — | — | EP | claimed |
| EP-0650500-B1 | PROCESS FOR THE PREPARATION OF A PREPOLYMER EPOXY RESIN MIXTURE WITH OXAZOLIDINONE STRUCTURES | SIEMENS AG (DE) | 1997-05-02 | — | — | EP | claimed |
| US-5527874-A | CONTINUOUS PROCESS OF REACTING AN ISOCYANURATE-CONTAININGEPOXY RESIN USING AN IMIDAZOLE CATALYST IN A HEATED REACTORAND COOLING THE EXTRUDATE BY AN EXTERNAL COOLING DEVICE | SIEMENS AKTIENGESELLSCHAFT (DE) | 1996-06-18 | — | — | US | claimed |
| US-5496892-A | Oxazolidinone structures-containing prepolymeric epoxy resin mixture | SIEMENS AKTIENGESELLSCHAFT (DE) | 1996-03-05 | — | — | US | claimed |
| US-6225377-B1 | PRODUCING LATENTLY REACTIVE PREPOLYMER EPOXY RESIN MIXTURE POWDER | SIEMENS AKTIENGESELLSCHAFT (DE) | 2001-05-01 | — | — | US | disclosed |
| US-5576357-A | EPOXY RESIN, PHOTOINITIATOR, PHOSPHORUS-CONTAINING GLYCIDYL ESTER; FLAME-RESISTANT INJECTION MOLDINGS MATERIALS FOR COVERING AND ENCAPSULATING ELECTRONIC COMPONENTS | SIEMENS AKTIENGESELLSCHAFT (DE) | 1996-11-19 | — | — | US | disclosed |
| US-5527874-A | CONTINUOUS PROCESS OF REACTING AN ISOCYANURATE-CONTAININGEPOXY RESIN USING AN IMIDAZOLE CATALYST IN A HEATED REACTORAND COOLING THE EXTRUDATE BY AN EXTERNAL COOLING DEVICE | SIEMENS AKTIENGESELLSCHAFT (DE) | 1996-06-18 | — | — | US | disclosed |
| US-5496892-A | Oxazolidinone structures-containing prepolymeric epoxy resin mixture | SIEMENS AKTIENGESELLSCHAFT (DE) | 1996-03-05 | — | — | US | disclosed |
| US-5458978-A | Halogen-free, inflammability | RUTGERSWERKE ATKIENGESELLSCHAFT AG (DE) | 1995-10-17 | — | — | US | disclosed |
| US-5376453-A | Nonflammable moldings with high glass transition temperature | SIEMENS AKTIENGESELLSCHAFT (DE) | 1994-12-27 | — | — | US | disclosed |
| US-5036135-A | Comprising a phosphorus-free diepoxide, an epoxy-group-contai ning phosphorus compound, a diisocyanate, a curing catalyst an d filler; nonflammable molding materials | SIEMENS AKTIENGESELLSCHAFT (DE) | 1991-07-30 | — | — | US | disclosed |