⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9351430 | 0.60 | — | — | |
| SCHEMBL4243616 | 0.59 | — | — | |
| SCHEMBL8973533 | 0.55 | — | — | |
| SCHEMBL4791801 | 0.54 | — | — | |
| SCHEMBL14875098 | 0.49 | — | — | |
| SCHEMBL6718535 | 0.46 | — | — | |
| SCHEMBL4910417 | 0.45 | — | — | |
| SCHEMBL19373005 | 0.36 | THRB (0.30) | — | |
| SCHEMBL38753 | 0.35 | — | — | |
| Hydroquinone SCHEMBL11511669 | 0.32 | ALOX15 (1.00) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6333101-B1 | PROVIDING TWO ADHERENDS ONE OF WHICH IS MADE OF A FLEXIBLE MATERIAL, JOINING ADHERENDS TOGETHER TO FORM A STRUCTURE USING A HEAT-RESISTANT ADHESIVE CONTAINING POLYCARBODIIMIDE RESIN AND AN EPOXY RESIN | NISSHINBO INDUSTRIES, INC. (JP) | 2001-12-25 | — | — | US | disclosed |
| EP-0557906-B1 | Heat-resistant adhesive composition | NISSHIN SPINNING (JP) | 1995-09-13 | — | — | EP | disclosed |
| EP-0557906-A1 | Heat-resistant adhesive composition | NISSHINBO INDUSTRIES, INC. (JP) | 1993-09-01 | — | — | EP | disclosed |