SCHEMBL7937314

SCHEMBL7937314

C=CC[SiH](OCCCCC)OCCCCC

nearest known ligand 0.39

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
TSHR P16473 6/20 0.39
ALDH1A1 P00352 1/20 0.37
HPGD P15428 1/20 0.32
PLA2G2C Q5R387 1/20 0.30
CA1 P00915 2/20 0.30
CA2 P00918 2/20 0.30
CA9 Q16790 2/20 0.30
MEN1 O00255 1/20 0.30
THRB P10828 1/20 0.30
HTT P42858 1/20 0.30
KMT2A Q03164 1/20 0.30
CA12 O43570 1/20 0.30
MAPT P10636 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5055538 0.98 TSHR (0.43) TSHRALDH1A1PLA2G2CCA1CA2
SCHEMBL2493359 0.98 TSHR (0.43) TSHRALDH1A1PLA2G2CCA1CA2
SCHEMBL198102 0.93 TSHR (0.39) TSHRALDH1A1HPGD
SCHEMBL296853 0.84 TSHR (0.33) TSHRALDH1A1
SCHEMBL15090851 0.83 TSHR (0.39) TSHRALDH1A1HPGDPLA2G2CCA1
SCHEMBL22661057 0.82 TSHR (0.32) TSHR
SCHEMBL22654291 0.79 TSHR (0.46) TSHRALDH1A1HPGDPLA2G2C
SCHEMBL2001507 0.79
SCHEMBL22654288 0.78 TSHR (0.50) TSHRALDH1A1PLA2G2C
SCHEMBL2001506 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11912889-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-27 US disclosed
US-20220220338-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-14 US disclosed
US-20220213348-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-07 US disclosed
US-11377522-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica-based coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-05 US disclosed
EP-3971229-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-03-23 EP disclosed
EP-3957678-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER Tokyo Ohka Kogyo Co., Ltd. (JP) 2022-02-23 EP disclosed
WO-2020235325-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER 東京応化工業株式会社 (JP) 2020-11-26 WO disclosed
US-20200362115-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA-BASED COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2020-11-19 US disclosed
WO-2020230828-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER 東京応化工業株式会社 2020-11-19 WO disclosed
EP-3176216-B1 HYDROPHILIC MATERIAL COMPRISING SULFONATE COPOLYMER AND AMINO RESIN MITSUI CHEMICALS INC (JP) 2019-04-24 EP disclosed
US-20160046827-A1 FILM COMPRISING COPOLYMER OR COMPOSITION MITSUI CHEMICALS, INC. (JP) 2016-02-18 US disclosed
EP-2985301-A1 COPOLYMER AND HYDROPHILIC MATERIAL COMPRISING SAME Mitsui Chemicals, Inc. (JP) 2016-02-17 EP disclosed
EP-2985324-A1 FILM COMPRISING COPOLYMER OR COMPOSITION Mitsui Chemicals, Inc. (JP) 2016-02-17 EP disclosed
US-20160032036-A1 COPOLYMER AND HYDROPHILIC MATERIAL COMPOSED OF THE SAME MITSUI CHEMICALS, INC. (JP) 2016-02-04 US disclosed
US-6232376-B1 BLEND CONTAINING ORGANOSILICON COMPOUND, PEROXIDE, HINDERED AMINE STABILIZER AND ANTIOXIDANTS NIPPON UNICAR COMPANY LTD. (JP) 2001-05-15 US disclosed
US-4857250-A One-extrusion method of making a shaped crosslinkable extruded polymeric product UNION CARBIDE CORPORATION (US) 1989-08-15 US disclosed
EP-0163865-B1 ONE-EXTRUSION METHOD FOR MAKING A SHAPED CROSSLINKED POLYMERIC PRODUCT UNION CARBIDE CORPORATION (US) 1988-06-15 EP disclosed
EP-0235439-A1 Electrically conductive polymers and their production RAPRA TECHNOLOGY LIMITED (GB) 1987-09-09 EP disclosed
EP-0163865-A1 One-extrusion method for making a shaped crosslinked polymeric product UNION CARBIDE CORPORATION (US) 1985-12-11 EP disclosed
WO-1985004618-A1 ONE-EXTRUSION METHOD OF MAKING A SHAPED CROSSLINKABLE EXTRUDED POLYMERIC PRODUCT UNION CARBIDE CORPORATION (US) 1985-10-24 WO disclosed