SCHEMBL7943884

SCHEMBL7943884

CCCCCCCCCc1ccccc1OC(c1c(C(C)(C)C)cc(C)cc1C(C)(C)C)C(CO)(CO)CO

nearest known ligand 0.39

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
THRA P10827 1/20 0.39
THRB P10828 1/20 0.39
LIPG Q9Y5X9 1/20 0.36
ALOX5 P09917 1/20 0.36
PTGS2 P35354 1/20 0.36
PPARA Q07869 3/20 0.35
PPARG P37231 1/20 0.34
TSHR P16473 1/20 0.34
MEN1 O00255 1/20 0.33
ALDH1A1 P00352 1/20 0.33
KMT2A Q03164 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7945365 1.00 THRA (0.39) THRATHRBLIPGALOX5PTGS2
SCHEMBL10487655 0.90 THRA (0.38) THRATHRBLIPGALOX5PTGS2
SCHEMBL10487604 0.90 THRA (0.38) THRATHRBLIPGALOX5PTGS2
SCHEMBL11124195 0.81 THRA (0.43) THRATHRBLIPGALOX5PTGS2
SCHEMBL11122899 0.81 THRA (0.43) THRATHRBLIPGALOX5PTGS2
SCHEMBL10775029 0.79 THRA (0.45) THRATHRBLIPGALOX5PTGS2
SCHEMBL7529783 0.79 THRA (0.45) THRATHRBLIPGALOX5PTGS2
SCHEMBL6058927 0.79 THRA (0.45) THRATHRBLIPGALOX5PTGS2
SCHEMBL7522466 0.79 THRA (0.45) THRATHRBLIPGALOX5PTGS2
SCHEMBL9068449 0.79 THRA (0.45) THRATHRBLIPGALOX5PTGS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160215124-A1 THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND METHOD FOR MANUFACTURING THE RESIN MOLDED ARTICLE WITH PLATING LAYER MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2016-07-28 US disclosed
EP-3042980-A1 THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND METHOD FOR PRODUCING PLATING-LAYER-EQUIPPED RESIN MOLDED ARTICLE Mitsubishi Engineering-Plastics Corporation (JP) 2016-07-13 EP disclosed
US-9365693-B2 Thermoplastic resin composition, resin article, and method of manufacturing resin article with plated layer MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2016-06-14 US disclosed
US-8933161-B2 Thermoplastic resin composition, resin molded article, and method of manufacturing resin molded article with plated layer MITSUBISHI CHEMICAL EUROPE GMBH (DE) 2015-01-13 US disclosed
EP-2711399-B1 THERMOPLASTIC RESIN COMPOSITION, RESIN ARTICLE, AND METHOD OF MANUFACTURING RESIN ARTICLE WITH PLATED LAYER MITSUBISHI ENG PLASTICS CORP (JP) 2014-12-31 EP disclosed
EP-2676799-B1 THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND METHOD OF MANUFACTORING RESIN MOLDED ARTICLE WITH PLATED LAYER MITSUBISHI CHEMICAL EUROPE GMBH (DE) 2014-06-11 EP disclosed
US-20140147682-A1 THERMOPLASTIC RESIN COMPOSITION, RESIN ARTICLE, AND METHOD OF MANUFACTURING RESIN ARTICLE WITH PLATED LAYER GLOBAL POLYACETAL CO., LTD. (JP) 2014-05-29 US disclosed
EP-2711399-A1 THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDING PRODUCT, AND METHOD FOR PRODUCING RESIN MOLDING PRODUCT HAVING PLATING LAYER Mitsubishi Engineering-Plastics Corporation (JP) 2014-03-26 EP disclosed
US-20140002311-A1 THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND METHOD OF MANUFACTURING RESIN MOLDED ARTICLE WITH PLATED LAYER MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2014-01-02 US disclosed
EP-2676799-A1 THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDING, AND PROCESS FOR PRODUCING RESIN MOLDING HAVING PLATING LAYER ATTACHED THERETO Mitsubishi Chemical Europe GmbH (DE) 2013-12-25 EP disclosed
US-6265472-B1 BLEND CONTAINING COPPER PHTHALOCYANINE ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 2001-07-24 US disclosed
US-4371647-A 2,6-Di-tertiary butyl phenyl pentaerythritol spiro bis-phosphites enhancing the stability to heat and light of synthetic resin ADEKA ARGUS CHEMICAL CO. LTD. (JP) 1983-02-01 US disclosed
EP-0038876-A1 2,6-Di-tertiary butyl phenyl pentaerythritol spiro bis-phosphites enhancing the stability to heat and light of synthetic resins, stabilizer compositions comprising phenolic antioxidants and such phosphites, and synthetic resin compositions containing the same ADEKA ARGUS CHEMICAL CO., Ltd. (JP) 1981-11-04 EP disclosed