SCHEMBL7945467

SCHEMBL7945467

CC(C)=C(C)C(=O)Oc1ncncn1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27918244 0.80 ELANE (0.39)
SCHEMBL27528873 0.76
SCHEMBL782969 0.70 MEN1 (0.37)
SCHEMBL29043932 0.70 P2RX7 (0.31)
SCHEMBL9420617 0.69
SCHEMBL28560571 0.69 ELANE (0.41)
SCHEMBL10552758 0.69 ALDH1A1 (0.38)
SCHEMBL10917585 0.68 KDM4E (0.34)
SCHEMBL27488125 0.68 ALDH1A1 (0.38)
SCHEMBL28056925 0.68 HIF1A (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11697762-B2 Organic-inorganic hybrid coating layer, quantum dot nanocapsule, quantum dot light emitting diode package, and method of fabricating the same KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, SEJONG CAMPUS (KR) 2023-07-11 US disclosed
WO-2020040507-A1 QUANTUM DOT NANOCAPSULE AND METHOD FOR PREPARING SAME 고려대학교 세종산학협력단 2020-02-27 WO disclosed
US-6274687-B1 EMULSION POLYMERIZATION DAISO CO., LTD. (JP) 2001-08-14 US disclosed
EP-0982365-A1 EPOXY RESIN COMPOSITION Daiso Co., Ltd. (JP) 2000-03-01 EP disclosed