SCHEMBL7950633

SCHEMBL7950633

CC(C)COC(=O)OOOC(C)(C)C

nearest known ligand 0.38

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.38
ALDH1A1 P00352 1/20 0.35
MEN1 O00255 1/20 0.34
LMNA P02545 1/20 0.34
CYP3A4 P08684 1/20 0.34
CYP2C9 P11712 1/20 0.34
NFKB1 P19838 1/20 0.34
PTGS1 P23219 1/20 0.34
APEX1 P27695 1/20 0.34
THPO P40225 1/20 0.34
PMP22 Q01453 1/20 0.34
KMT2A Q03164 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
MAPK1 P28482 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8040190 0.88 TSHR (0.41) TSHRALDH1A1MEN1LMNACYP3A4
SCHEMBL7940104 0.85 TSHR (0.36) TSHRALDH1A1MEN1LMNACYP3A4
SCHEMBL30877068 0.84 TSHR (0.35) TSHRALDH1A1MEN1LMNACYP3A4
SCHEMBL30018016 0.83 TSHR (0.46) TSHRALDH1A1MEN1LMNACYP3A4
SCHEMBL30877067 0.82 TSHR (0.34) TSHRALDH1A1MEN1LMNACYP3A4
SCHEMBL30877065 0.81 TSHR (0.33) TSHRALDH1A1MEN1LMNACYP3A4
SCHEMBL631747 0.79 TSHR (0.50) TSHRALDH1A1MEN1LMNACYP3A4
SCHEMBL30877066 0.79 TSHR (0.32) TSHR
SCHEMBL28440470 0.78 ALDH1A1 (0.50) TSHRALDH1A1LMNACYP3A4PMP22
SCHEMBL8201970 0.77 TSHR (0.38) TSHRALDH1A1MEN1LMNACYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2217567-B1 PEROXIDE COMPOSITION DSM IP ASSETS BV (NL) 2016-05-11 EP claimed
JP-62124148-A None JP disclosed
WO-2025075152-A1 GRANULAR BODY, METHOD FOR PRODUCING SAME, AND THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075121-A1 CROSS-LINKED RESIN PARTICLES AND METHOD FOR PRODUCING SAME 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075118-A1 THERMOPLASTIC RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075124-A1 MOLDED FILM OR MOLDED SHEET 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075122-A1 CROSSLINKED RESIN PARTICLES AND THERMOPLASTIC RESIN MODIFIER 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075116-A1 THERMOPLASTIC RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075125-A1 BLOW-MOLDED ARTICLE AND METHOD FOR PRODUCING SAME 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075117-A1 THERMOPLASTIC RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
CN-117120547-A Thermally cured piezoelectric composites and their use in additive manufacturing 施乐公司 2023-11-24 CN disclosed
US-10392460-B2 Process for producing graft copolymers on polyolefin backbone BOREALIS AG (AT) 2019-08-27 US disclosed
US-20170260312-A1 PROCESS FOR PRODUCING GRAFT COPOLYMERS ON POLYOLEFIN BACKBONE BOREALIS AG (AT) 2017-09-14 US disclosed
US-9468097-B2 Resin composition for printed circuit board, prepreg for printed circuit board, laminate, metal-clad laminate, printed circuit board, and magnesium oxide, and method for manufacturing magnesium oxide PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2016-10-11 US disclosed
WO-2016038177-A1 PROCESS FOR PRODUCING GRAFT COPOLYMERS ON POLYOLEFIN BACKBONE BOREALIS AG (AT) 2016-03-17 WO disclosed
EP-2995631-A1 Process for producing graft copolymers on polyolefin backbone Borealis AG (AT) 2016-03-16 EP disclosed
US-20150366056-A1 RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, PREPREG FOR PRINTED CIRCUIT BOARD, LAMINATE, METAL-CLAD LAMINATE, PRINTED CIRCUIT BOARD, AND MAGNESIUM OXIDE, AND METHOD FOR MANUFACTURING MAGNESIUM OXIDE PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2015-12-17 US disclosed
CN-103946021-B Metal-coated laminated board and printed substrate Panasonic Intellectual Property Management Co.,Ltd. (JP) 2015-11-25 CN disclosed
US-6258889-B1 Emulsion and production process therefor NIPPON BEE CHEMICAL CO., LTD. (JP) 2001-07-10 US disclosed
JP-S62124148-A CROSSLINKING AGENT FOR SILICONE RUBBER KAYAKU NUURII KK 1987-06-05 JP disclosed