⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6419350 | 0.87 | — | — | |
| SCHEMBL717404 | 0.87 | — | — | |
| SCHEMBL6291948 | 0.87 | — | — | |
| SCHEMBL31663488 | 0.87 | — | — | |
| SCHEMBL5836490 | 0.87 | — | — | |
| SCHEMBL29869586 | 0.87 | — | — | |
| SCHEMBL9562011 | 0.82 | — | — | |
| SCHEMBL2285707 | 0.82 | — | — | |
| SCHEMBL11582574 | 0.82 | — | — | |
| SCHEMBL9874288 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 186 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119876676-A | Ti (titanium)4AlN3-Al2O3Reinforced SAC composite wear-resistant material and application thereof in aspect of sleeve surface texturing filling | 武汉理工大学 | 2025-04-25 | — | — | CN | claimed |
| CN-222199014-U | Higher drill bit alloy drill bit of cutting accuracy | 奥斯机(上海)精密工具有限公司 | 2024-12-20 | — | — | CN | claimed |
| CN-119120976-A | New energy electric automobile motor shaft and preparation process thereof | 重庆众青齿轮有限公司 | 2024-12-13 | — | — | CN | claimed |
| WO-2024183667-A1 | ATOMIZATION CORE FOR ELECTRONIC ATOMIZER AND ITS PROCESSING METHOD | Shanghai QV Technologies Co., Ltd. (CN) | 2024-09-12 | — | — | WO | claimed |
| CN-116121694-B | Safety knife blade with high-hardness antirust coating and preparation method thereof | 宁波兴伟刀具科技有限公司 | 2024-07-16 | — | — | CN | claimed |
| CN-118136615-B | Thin film resistor, preparation method thereof, electronic device, chip and electronic equipment | 北京智芯微电子科技有限公司 | 2024-07-16 | — | — | CN | claimed |
| CN-118136615-A | Thin film resistor, preparation method thereof, electronic device, chip and electronic equipment | 北京智芯微电子科技有限公司 | 2024-06-04 | — | — | CN | claimed |
| US-20240047324-A1 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2024-02-08 | — | — | US | claimed |
| WO-2023201766-A1 | ANTI-CORROSION AND ANTI-FOULING COMPOSITE TREATMENT METHOD FOR SURFACE OF ADDITIVE MANUFACTURING METAL PART | 东南大学 | 2023-10-26 | — | — | WO | claimed |
| CN-219727467-U | Cemented carbide planker with excellent heat resistance | 无锡市南洋机床配件有限公司 | 2023-09-22 | — | — | CN | claimed |
| CN-101289222-A | Method for preparing high-pure and superfine titanium-aluminum-nitrogen powder | UNIV TSINGHUA (CN) | 2008-10-22 | — | — | CN | claimed |
| US-20080100904-A1 | MICRO MIRRORS WITH HINGES | SPATIAL PHOTONICS, INC. (US) | 2008-05-01 | — | — | US | claimed |
| EP-1916559-A1 | Micro mirrors with metal alloy hinges | Spatial Photonics, Inc. (US) | 2008-04-30 | — | — | EP | claimed |
| US-6841478-B2 | Method of forming a multi-layered copper bond pad for an integrated circuit | MICRON TECHNOLOGY, INC. (US) | 2005-01-11 | — | — | US | claimed |
| US-20040056361-A1 | Multi-layered copper bond pad for an integrated circuit | MCTEER ALLEN (US) | 2004-03-25 | — | — | US | claimed |
| US-6642623-B2 | Multi-layered copper bond pad for an integrated circuit | MICRON TECHNOLOGY, INC. | 2003-11-04 | — | — | US | claimed |
| US-20030160330-A1 | Multilayer bonding pad; overcoating copper with titanium-aluminum alloy; passivation, annealing | MICRON TECHNOLOGY, INC. | 2003-08-28 | — | — | US | claimed |
| US-20020090804-A1 | Copper interconnect for an integrated circuit and methods for its fabrication | MICRON TECHNOLOGY, INC. | 2002-07-11 | — | — | US | claimed |
| US-6373137-B1 | Copper interconnect for an integrated circuit and methods for its fabrication | MICRON TECHNOLOGY, INC. | 2002-04-16 | — | — | US | claimed |
| US-5888450-A | Fine grained ductile plastic injection molds forging tools and machine components and alloy steel therefor having a titanium nitride pinned austenitic grain structure | A. FINKL & SONS CO. (US) | 1999-03-30 | — | — | US | claimed |