Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL7993874

CCNCCCC[Si](OCC)(OCC)OCC.N

nearest known ligand 0.46

Full drug profile on Sugi Atlas →

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
CYP2C19 P33261 2/20 0.46
CYP1A2 P05177 1/20 0.46
MEN1 O00255 1/20 0.42
GLA P06280 1/20 0.42
KMT2A Q03164 1/20 0.42
TSHR P16473 2/20 0.41
KDM1A O60341 5/20 0.39
SAT1 P21673 3/20 0.33
HRH4 Q9H3N8 2/20 0.33
HRH3 Q9Y5N1 2/20 0.33
ALDH1A1 P00352 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2831239 0.98 CYP2C19 (0.48) CYP2C19CYP1A2MEN1GLAKMT2A
Ammonia Solution, Strong SCHEMBL7647790 0.94 CYP2C19 (0.44) CYP2C19CYP1A2MEN1GLAKMT2A
SCHEMBL270457 0.91 CYP2C19 (0.46) CYP2C19CYP1A2MEN1GLAKMT2A
Diethylamine SCHEMBL7638457 0.89 CYP2C19 (0.44) CYP2C19CYP1A2MEN1GLAKMT2A
SCHEMBL1194930 0.89 ALDH1A1 (0.42) CYP2C19CYP1A2MEN1GLAKMT2A
Methylamine SCHEMBL11311742 0.88 CYP2C19 (0.42) CYP2C19CYP1A2MEN1GLAKMT2A
SCHEMBL21359747 0.88 CYP2C19 (0.48) CYP2C19CYP1A2MEN1GLAKMT2A
SCHEMBL11685101 0.86 CYP1A2 (0.43) CYP2C19CYP1A2MEN1GLAKMT2A
SCHEMBL1777209 0.85 ALDH1A1 (0.39) CYP2C19CYP1A2MEN1GLAKMT2A
SCHEMBL28992785 0.85 ALDH1A1 (0.39) CYP2C19CYP1A2MEN1GLAKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6077908-A VINYL POLYMER HAVING A PRIMARY ACID AMIDE GROUP AND AN ACID IMIDE GROUP. EXCELLENT IN HEAT STABILITY IN MOLDING AND WEATHERABILITY AND SUITED FOR USE AS A MOLDING MATERIAL FOR ELECTRIC AND ELECTRONIC PARTS AND AUTOMOTIVE PARTS. ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 2000-06-20 US disclosed