SCHEMBL800512

SCHEMBL800512

CCC(C)(C)C(=O)OCC(=O)O

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PAM P19021 3/20 0.39
HMGCR P04035 5/20 0.38
CYP4F2 P78329 1/20 0.37
CYP4A11 Q02928 1/20 0.37
TSHR P16473 2/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
CTH P32929 1/20 0.33
CBS P35520 1/20 0.33
THPO P40225 1/20 0.33
FFAR3 O14843 1/20 0.33
THRB P10828 1/20 0.32
CHRM1 P11229 1/20 0.32
TBXA2R P21731 1/20 0.32
ADRA1A P35348 1/20 0.32
RIPK1 Q13546 3/20 0.32
CYP2D6 P10635 1/20 0.31
CYP2C19 P33261 1/20 0.31
HIF1A Q16665 1/20 0.31
GLA P06280 1/20 0.31
L3MBTL1 Q9Y468 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL800517 0.83 CYP4F2 (0.35) HMGCRCYP4F2CYP4A11RIPK1
SCHEMBL16352658 0.82 CYP4F2 (0.37) HMGCRCYP4F2CYP4A11
SCHEMBL22926635 0.80 KDM4E (0.40) PAMHMGCRCYP4F2CYP4A11TSHR
SCHEMBL17589176 0.80 MAPK1 (0.42) HMGCRCYP4F2CYP4A11SMN1; SMN2
SCHEMBL17589170 0.80 TDP1 (0.38) HMGCRCYP4F2CYP4A11
SCHEMBL17708339 0.80 CYP4F2 (0.36) HMGCRCYP4F2CYP4A11THPOCYP2C19
SCHEMBL20100807 0.79 PAM (0.33) PAMCYP4F2CYP4A11
SCHEMBL15697275 0.78 PAM (0.37) PAMHMGCRTSHRSMN1; SMN2CTH
SCHEMBL10033549 0.78 CYP4F2 (0.35) HMGCRCYP4F2CYP4A11THRB
SCHEMBL2607778 0.78 TET2 (0.38) HMGCRCYP4F2CYP4A11TSHRL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 219 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11662663-B2 Substrate protective film-forming composition and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-30 US disclosed
US-20180120705-A1 PATTERN FORMING METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed
US-20180087010-A1 PRE-RINSING LIQUID, PRE-RINSING TREATMENT METHOD, AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2018-03-29 US disclosed
US-9926462-B2 Composition for forming liquid immersion upper layer film, and polymer JSR CORPORATION (JP) 2018-03-27 US disclosed
US-9778568-B2 Positive resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-10-03 US disclosed
US-9778568-B2 Positive resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-10-03 US disclosed
US-9612535-B2 Pattern forming method, electron beam- or extreme ultraviolet-sensitive resin composition, resist film using the same, method of manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2017-04-04 US disclosed
US-20170073541-A1 COMPOSITION FOR FORMING LIQUID IMMERSION UPPER LAYER FILM, AND POLYMER JSR CORPORATION (JP) 2017-03-16 US disclosed
US-9540535-B2 Composition for forming liquid immersion upper layer film, and polymer JSR CORPORATION (JP) 2017-01-10 US disclosed
US-9519213-B2 Patterning process and resist composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-12-13 US disclosed
US-20080096131-A1 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2008-04-24 US disclosed
US-7354693-B2 Polymer, resist protective coating material, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-04-08 US disclosed
US-20080008960-A1 Mixture of an adamantane acrylic ester resin which becomes soluble in alkaline developer under action of an acid and sulfonium salt acid generator; microlithography with advantages of resolution, pattern density dependence and mask fidelity; use in precise microfabrication SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-01-10 US disclosed
US-20080008962-A1 Polymerizable ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2008-01-10 US disclosed
US-20080008961-A1 POSITIVE RESIST COMPOSITIONS AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-01-10 US disclosed
US-20080008959-A1 Resin comprising monomers of cyclopentyl- or cyclohexyl (meth)acrylate; hydroxyadamantyl (meth)acrylate; 3,8-epoxy-6-oxabicyclo[3.2.1]octyl (meth)acrylat;, and/or fluoroalkyl (meth)acrylate; ArF lithography; resolution; forms a pattern with high rectangularity SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-01-10 US disclosed
US-20070231741-A1 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-10-04 US disclosed
US-20070178407-A1 Polymer, resist protective coating material, and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2007-08-02 US disclosed
US-20070122741-A1 Resist protective coating material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-05-31 US disclosed
US-20070003867-A1 Resist protective coating material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-01-04 US disclosed