SCHEMBL801340

SCHEMBL801340

CCCCOC(=O)CCCCCOCC(O)COC(=O)C(C)(C)CC

nearest known ligand 0.48

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
LPAR1 Q92633 7/20 0.48
ENPP2 Q13822 6/20 0.48
LPAR5 Q9H1C0 4/20 0.48
LPAR4 Q99677 3/20 0.48
LPAR2 Q9HBW0 3/20 0.48
LPAR3 Q9UBY5 3/20 0.48
LPAR6 P43657 2/20 0.48
KDM4E B2RXH2 1/20 0.47
DUSP3 P51452 1/20 0.47
MEN1 O00255 1/20 0.47
KMT2A Q03164 1/20 0.47
LMNA P02545 1/20 0.47
DGKA P23743 1/20 0.44
TRPV1 Q8NER1 2/20 0.43
CES2 O00748 1/20 0.43
MAPT P10636 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12452124 0.95 LPAR1 (0.51) LPAR1ENPP2LPAR5LPAR4LPAR2
SCHEMBL12452128 0.95 LPAR1 (0.51) LPAR1ENPP2LPAR5LPAR4LPAR2
SCHEMBL12452045 0.93 LPAR1 (0.53) LPAR1ENPP2LPAR5LPAR4LPAR2
SCHEMBL801349 0.93 LPAR1 (0.53) LPAR1ENPP2LPAR5LPAR4LPAR2
SCHEMBL801879 0.93 LPAR1 (0.53) LPAR1ENPP2LPAR5LPAR4LPAR2
SCHEMBL17084866 0.91 LPAR1 (0.58) LPAR1ENPP2LPAR5LPAR4LPAR2
SCHEMBL12691517 0.91 LPAR1 (0.58) LPAR1ENPP2LPAR5LPAR4LPAR2
SCHEMBL10093755 0.89 LPAR1 (0.51) LPAR1ENPP2LPAR5LPAR4LPAR2
SCHEMBL12452121 0.89 LPAR1 (0.51) LPAR1ENPP2LPAR5LPAR4LPAR2
SCHEMBL12452082 0.87 ATM (0.46) LPAR1ENPP2LPAR5LPAR4LPAR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10025011-B2 Composition, infrared transmission filter and method for manufacturing the same, and infrared sensor FUJIFILM CORPORATION (JP) 2018-07-17 US disclosed
US-9818778-B2 Solid-state image sensor and its manufacturing method, curable composition for forming infrared cut-off filters, and camera module FUJIFILM CORPORATION (JP) 2017-11-14 US disclosed
US-9810821-B2 Infrared ray cutoff filter FUJIFILM CORPORATION (JP) 2017-11-07 US disclosed
US-9664827-B2 Colored composition, method of producing color filter using the same, color filter and solid-state imaging device FUJIFILM CORPORATION (JP) 2017-05-30 US disclosed
US-9625618-B2 Optical member set and solid-state imaging element using the same FUJIFILM CORPORATION (JP) 2017-04-18 US disclosed
US-9442373-B2 Method of producing color filter and solid-state imaging device having colored composition containing color agent FUJIFILM CORPORATION (JP) 2016-09-13 US disclosed
US-9389507-B2 Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition FUJIFILM CORPORATION (JP) 2016-07-12 US disclosed
US-9354514-B2 Photosensitive transparent composition for color filter of solid-state imaging device, and production method of color filter of solid-state imaging device, color filter of solid-state imaging device, and solid-state imaging device, each using the same FUJIFILM CORPORATION (JP) 2016-05-31 US disclosed
US-20150372037-A1 SOLID-STATE IMAGE SENSOR AND ITS MANUFACTURING METHOD, CURABLE COMPOSITION FOR FORMING INFRARED CUT-OFF FILTERS, AND CAMERA MODULE FUJIFILM CORPORATION (JP) 2015-12-24 US disclosed
US-20150293281-A1 CURABLE RESIN COMPOSITION FOR FORMING INFRARED REFLECTIVE FILM, INFRARED REFLECTIVE FILM AND MANUFACTURING METHOD THEREOF, INFRARED RAY CUT-OFF FILTER, AND SOLID-STATE IMAGING DEVICE USING THE SAME FUJIFILM CORPORATION (JP) 2015-10-15 US disclosed
US-20140145286-A1 COLORED COMPOSITION, METHOD OF PRODUCING COLOR FILTER USING THE SAME, COLOR FILTER AND SOLID-STATE IMAGING DEVICE FUJIFILM CORPORATION (JP) 2014-05-29 US disclosed
US-8735483-B2 Polymerizable composition FUJIFILM CORPORATION (JP) 2014-05-27 US disclosed
US-8728712-B2 Polymerizable composition FUJIFILM CORPORATION (JP) 2014-05-20 US disclosed
US-20130285182-A1 PHOTOSENSITIVE TRANSPARENT COMPOSITION FOR COLOR FILTER OF SOLID-STATE IMAGING DEVICE, AND PRODUCTION METHOD OF COLOR FILTER OF SOLID-STATE IMAGING DEVICE, COLOR FILTER OF SOLID-STATE IMAGING DEVICE, AND SOLID-STATE IMAGING DEVICE, EACH USING THE SAME FUJIFILM CORPORATION (JP) 2013-10-31 US disclosed
US-20130143164-A1 POLYMERIZABLE COMPOSITION FUJIFILM CORPORATION (JP) 2013-06-06 US disclosed
US-20130072615-A1 POLYMERIZABLE COMPOSITION FUJIFILM CORPORATION (JP) 2013-03-21 US disclosed
US-20120257283-A1 DISPERSION COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, AND SOLID-STATE IMAGE PICK-UP ELEMENT FUJIFILM CORPORATION (JP) 2012-10-11 US disclosed
US-8278386-B2 Dispersion composition, polymerizable composition, light-shielding color filter, solid-state image pick-up element, liquid crystal display device, wafer level lens, and image pick-up unit FUJIFILM CORPORATION (JP) 2012-10-02 US disclosed
US-20120068292-A1 POLYMERIZABLE COMPOSITION, AND PHOTOSENSITIVE LAYER, PERMANENT PATTERN, WAFER-LEVEL LENS, SOLID-STATE IMAGING DEVICE AND PATTERN FORMING METHOD EACH USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2012-03-22 US disclosed
US-20110124824-A1 DISPERSION COMPOSITION, POLYMERIZABLE COMPOSITION, LIGHT-SHIELDING COLOR FILTER, SOLID-STATE IMAGE PICK-UP ELEMENT, LIQUID CRYSTAL DISPLAY DEVICE, WAFER LEVEL LENS, AND IMAGE PICK-UP UNIT FUJIFILM CORPORATION (JP) 2011-05-26 US disclosed