SCHEMBL801349

SCHEMBL801349

CCCCOC(=O)CCCCCOC(=O)CCC(=O)OCC(O)COC(=O)C(C)(C)CC

nearest known ligand 0.53

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
LPAR1 Q92633 7/20 0.53
ENPP2 Q13822 6/20 0.53
LPAR4 Q99677 3/20 0.53
LPAR5 Q9H1C0 3/20 0.53
LPAR2 Q9HBW0 3/20 0.53
LPAR3 Q9UBY5 3/20 0.53
LPAR6 P43657 2/20 0.53
KDM4E B2RXH2 1/20 0.52
DUSP3 P51452 1/20 0.52
MEN1 O00255 1/20 0.52
KMT2A Q03164 1/20 0.52
LMNA P02545 1/20 0.52
MAPT P10636 1/20 0.48
TRPV1 Q8NER1 2/20 0.47
CES2 O00748 1/20 0.47
DGKA P23743 2/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12452045 1.00 LPAR1 (0.53) LPAR1ENPP2LPAR4LPAR5LPAR2
SCHEMBL12691517 0.96 LPAR1 (0.58) LPAR1ENPP2LPAR4LPAR5LPAR2
SCHEMBL17084866 0.96 LPAR1 (0.58) LPAR1ENPP2LPAR4LPAR5LPAR2
SCHEMBL12452124 0.95 LPAR1 (0.51) LPAR1ENPP2LPAR4LPAR5LPAR2
SCHEMBL12452128 0.95 LPAR1 (0.51) LPAR1ENPP2LPAR4LPAR5LPAR2
SCHEMBL12452121 0.94 LPAR1 (0.51) LPAR1ENPP2LPAR4LPAR5LPAR2
SCHEMBL10093755 0.94 LPAR1 (0.51) LPAR1ENPP2LPAR4LPAR5LPAR2
SCHEMBL801340 0.93 LPAR1 (0.48) LPAR1ENPP2LPAR4LPAR5LPAR2
SCHEMBL801879 0.92 LPAR1 (0.53) LPAR1ENPP2LPAR4LPAR5LPAR2
SCHEMBL801865 0.89 ATM (0.46) LPAR1ENPP2LPAR4LPAR5LPAR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9818778-B2 Solid-state image sensor and its manufacturing method, curable composition for forming infrared cut-off filters, and camera module FUJIFILM CORPORATION (JP) 2017-11-14 US disclosed
US-9389507-B2 Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition FUJIFILM CORPORATION (JP) 2016-07-12 US disclosed
US-20150372037-A1 SOLID-STATE IMAGE SENSOR AND ITS MANUFACTURING METHOD, CURABLE COMPOSITION FOR FORMING INFRARED CUT-OFF FILTERS, AND CAMERA MODULE FUJIFILM CORPORATION (JP) 2015-12-24 US disclosed
US-8936371-B2 Wafer level lens, production method of wafer level lens, and imaging unit FUJIFILM CORPORATION (JP) 2015-01-20 US disclosed
US-20140255846-A1 POLYMERIZABLE COMPOSITION, AND PHOTOSENSITIVE LAYER, PERMANENT PATTERN, WAFER-LEVEL LENS, SOLID-STATE IMAGING DEVICE AND PATTERN FORMING METHOD EACH USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2014-09-11 US disclosed
US-20140246566-A1 WAFER LEVEL LENS, PRODUCTION METHOD OF WAFER LEVEL LENS, AND IMAGING UNIT FUJIFILM CORPORATION (JP) 2014-09-04 US disclosed
US-8766388-B2 Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition FUJIFILM CORPORATION (JP) 2014-07-01 US disclosed
US-8735483-B2 Polymerizable composition FUJIFILM CORPORATION (JP) 2014-05-27 US disclosed
US-20130072615-A1 POLYMERIZABLE COMPOSITION FUJIFILM CORPORATION (JP) 2013-03-21 US disclosed
US-8278386-B2 Dispersion composition, polymerizable composition, light-shielding color filter, solid-state image pick-up element, liquid crystal display device, wafer level lens, and image pick-up unit FUJIFILM CORPORATION (JP) 2012-10-02 US disclosed
US-20120134028-A1 WAFER LEVEL LENS, PRODUCTION METHOD OF WAFER LEVEL LENS, AND IMAGING UNIT FUJIFILM CORPORATION (JP) 2012-05-31 US disclosed
US-20120068292-A1 POLYMERIZABLE COMPOSITION, AND PHOTOSENSITIVE LAYER, PERMANENT PATTERN, WAFER-LEVEL LENS, SOLID-STATE IMAGING DEVICE AND PATTERN FORMING METHOD EACH USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2012-03-22 US disclosed
US-20110124824-A1 DISPERSION COMPOSITION, POLYMERIZABLE COMPOSITION, LIGHT-SHIELDING COLOR FILTER, SOLID-STATE IMAGE PICK-UP ELEMENT, LIQUID CRYSTAL DISPLAY DEVICE, WAFER LEVEL LENS, AND IMAGE PICK-UP UNIT FUJIFILM CORPORATION (JP) 2011-05-26 US disclosed