Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.43 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | HMGCR | P04035 | 2/20 | 0.32 |
| ▸ | PRKCA | P17252 | 1/20 | 0.31 |
| ▸ | CYP4F2 | P78329 | 1/20 | 0.30 |
| ▸ | CYP4A11 | Q02928 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12126256 | 1.00 | TDP1 (0.43) | TDP1MAPK1MAPTHMGCRPRKCA | |
| SCHEMBL18104408 | 1.00 | TDP1 (0.43) | TDP1MAPK1MAPTHMGCRPRKCA | |
| SCHEMBL16520399 | 0.98 | TDP1 (0.44) | TDP1MAPK1MAPTHMGCRPRKCA | |
| SCHEMBL12442153 | 0.87 | PRKCA (0.31) | PRKCACYP4F2CYP4A11 | |
| SCHEMBL15613838 | 0.87 | PRKCA (0.31) | PRKCACYP4F2CYP4A11 | |
| SCHEMBL9610865 | 0.87 | PRKCA (0.31) | PRKCACYP4F2CYP4A11 | |
| SCHEMBL9923570 | 0.87 | PRKCA (0.31) | PRKCACYP4F2CYP4A11 | |
| SCHEMBL20276226 | 0.87 | PRKCA (0.34) | PRKCACYP4F2CYP4A11 | |
| SCHEMBL6380226 | 0.86 | MAPT (0.43) | TDP1MAPK1MAPTHMGCRPRKCA | |
| SCHEMBL1426847 | 0.84 | PRKCA (0.44) | TDP1MAPK1MAPTPRKCA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9389505-B2 | Polymerizable composition for solder resist, and solder resist pattern formation method | FUJIFILM CORPORATION (JP) | 2016-07-12 | — | — | US | disclosed |
| US-8908293-B2 | Dispersion composition, photosensitive resin composition, and solid-state image pick-up element | FUJIFILM CORPORATION (JP) | 2014-12-09 | — | — | US | disclosed |
| US-8766388-B2 | Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition | FUJIFILM CORPORATION (JP) | 2014-07-01 | — | — | US | disclosed |
| US-20130034812-A1 | POLYMERIZABLE COMPOSITION FOR SOLDER RESIST, AND SOLDER RESIST PATTERN FORMATION METHOD | FUJIFILM CORPORATION (JP) | 2013-02-07 | — | — | US | disclosed |
| US-8278386-B2 | Dispersion composition, polymerizable composition, light-shielding color filter, solid-state image pick-up element, liquid crystal display device, wafer level lens, and image pick-up unit | FUJIFILM CORPORATION (JP) | 2012-10-02 | — | — | US | disclosed |
| US-20120068292-A1 | POLYMERIZABLE COMPOSITION, AND PHOTOSENSITIVE LAYER, PERMANENT PATTERN, WAFER-LEVEL LENS, SOLID-STATE IMAGING DEVICE AND PATTERN FORMING METHOD EACH USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2012-03-22 | — | — | US | disclosed |
| US-20110124824-A1 | DISPERSION COMPOSITION, POLYMERIZABLE COMPOSITION, LIGHT-SHIELDING COLOR FILTER, SOLID-STATE IMAGE PICK-UP ELEMENT, LIQUID CRYSTAL DISPLAY DEVICE, WAFER LEVEL LENS, AND IMAGE PICK-UP UNIT | FUJIFILM CORPORATION (JP) | 2011-05-26 | — | — | US | disclosed |