SCHEMBL6380226

SCHEMBL6380226

CCC(C)(C)C(=O)OCC(C)O

nearest known ligand 0.43

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
MAPT P10636 1/20 0.43
MAPK1 P28482 1/20 0.41
PRKCA P17252 1/20 0.36
HMGCR P04035 4/20 0.36
HSD17B10 Q99714 1/20 0.35
CYP4F2 P78329 1/20 0.35
CYP4A11 Q02928 1/20 0.35
MMP8 P22894 1/20 0.33
TSHR P16473 2/20 0.32
TDP1 Q9NUW8 1/20 0.31
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16520399 0.87 TDP1 (0.44) MAPTMAPK1PRKCAHMGCRHSD17B10
SCHEMBL18104408 0.86 TDP1 (0.43) MAPTMAPK1PRKCAHMGCRCYP4F2
SCHEMBL801671 0.86 TDP1 (0.43) MAPTMAPK1PRKCAHMGCRCYP4F2
SCHEMBL12126256 0.86 TDP1 (0.43) MAPTMAPK1PRKCAHMGCRCYP4F2
SCHEMBL5068175 0.85 MAPT (0.44) MAPTMAPK1HMGCRHSD17B10CYP4F2
Dimethylaminoethanol SCHEMBL28231085 0.85 MAPT (0.36) MAPTMAPK1PRKCAHMGCRCYP4F2
SCHEMBL17898146 0.85 PRKCA (0.37) PRKCAHMGCRCYP4F2CYP4A11MMP8
SCHEMBL14769605 0.85 PRKCA (0.37) MAPTPRKCAHMGCRCYP4F2CYP4A11
SCHEMBL2681020 0.85 TSHR (0.42) MAPK1PRKCAHMGCRCYP4F2CYP4A11
SCHEMBL12135548 0.85 HMGCR (0.40) PRKCAHMGCRCYP4F2CYP4A11LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 157 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240219834-A1 METHOD FOR FORMING A RESIST PATTERN NISSAN CHEMICAL CORPORATION (JP) 2024-07-04 US disclosed
US-20230400767-A1 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMER, AND COMPOUND JSR CORPORATION (JP) 2023-12-14 US disclosed
US-20230244143-A9 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND COMPOUND JSR CORPORATION (JP) 2023-08-03 US disclosed
US-20230236506-A2 RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN JSR CORPORATION (JP) 2023-07-27 US disclosed
US-20230236501-A1 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND COMPOUND JSR CORPORATION (JP) 2023-07-27 US disclosed
US-20230229082-A2 RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN JSR CORPORATION (JP) 2023-07-20 US disclosed
US-11692050-B2 Photo-alignment copolymer, binder composition, binder layer, optical laminate, and image display device FUJIFILM CORPORATION (JP) 2023-07-04 US disclosed
US-11675270-B2 Resist underlayer film-forming composition NISSAN CHEMICAL CORPORATION (JP) 2023-06-13 US disclosed
US-20230159775-A1 INKJET INK KYOCERA DOCUMENT SOLUTIONS INC. (JP) 2023-05-25 US disclosed
US-20230150254-A1 ON-PRESS DEVELOPMENT TYPE LITHOGRAPHIC PRINTING PLATE PRECURSOR, METHOD OF PREPARING LITHOGRAPHIC PRINTING PLATE, AND LITHOGRAPHIC PRINTING METHOD FUJIFILM CORPORATION (JP) 2023-05-18 US disclosed
US-7462382-B2 Optical compensating sheet, production method thereof, optical film, and polarizing plate and liquid crystal display device using the same FUJIFILM CORPORATION (JP) 2008-12-09 US disclosed
US-7416833-B2 Photoresist undercoat-forming material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-08-26 US disclosed
US-7309560-B2 Composition for forming anti-reflective coating NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2007-12-18 US disclosed
US-20070238029-A1 Underlayer Coating Forming Composition for Lithography Containing Naphthalene Ring Having Halogen Atom NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2007-10-11 US disclosed
US-20070231738-A1 Resist composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-10-04 US disclosed
US-20070231745-A1 Method for preparation of lithographic printing plate and lithographic printing plate precursor FUJIFILM CORPORATION (JP) 2007-10-04 US disclosed
US-20070190459-A1 Resist underlayer coating forming composition for mask blank, mask blank and mask HOYA CORPORATION (JP) 2007-08-16 US disclosed
US-20070178407-A1 Polymer, resist protective coating material, and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2007-08-02 US disclosed
US-20050042536-A1 Photosensitive resin composition comprising quinonediazide sulfate ester compound DONGJIN SEMICHEM CO. LTD. (KR) 2005-02-24 US disclosed
WO-2003036388-A1 PHOTOSNESITIVE RESIN COMPOSITION COMPRISING QUINONEDIAZIDE SULFATE ESTER COMPOUND DONGJIN SEMICHEM CO., LTD. (KR) 2003-05-01 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20230229082-A2 RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN RAD51, RER1, RAD1 MAPT 3874/4885MAPK1 1803/4885PRKCA 4722/4885
US-20230236501-A1 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND COMPOUND RER1, RAD51, RAD1 MAPT 2657/4885MAPK1 848/4885PRKCA 4579/4885
US-20230400767-A1 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMER, AND COMPOUND RER1, RAD51, RFT1 MAPT 2356/4885MAPK1 459/4885PRKCA 3447/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.