SCHEMBL801852

SCHEMBL801852

CCN1CCCC1=CC=C(C)C#N

nearest known ligand 0.35

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
▸ INMT O95050 1/20 0.35
▸ ALDH1A1 P00352 2/20 0.35
▸ NPSR1 Q6W5P4 1/20 0.35
▸ MAPT P10636 1/20 0.30
▸ HPGD P15428 1/20 0.30
▸ SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17897735 0.86 MEN1 (0.38) INMTALDH1A1NPSR1MAPTHPGD
SCHEMBL25477357 0.86 MEN1 (0.38) INMTALDH1A1NPSR1MAPTHPGD
SCHEMBL14610351 0.79 MAPT (0.39) INMTALDH1A1NPSR1MAPTHPGD
SCHEMBL19058029 0.74 MEN1 (0.46) ALDH1A1NPSR1MAPTHPGDSMN1; SMN2
SCHEMBL9106682 0.66 — —
SCHEMBL17689272 0.64 INMT (0.38) INMTALDH1A1NPSR1MAPT
Acetic Acid SCHEMBL30330167 0.61 INMT (0.47) INMTALDH1A1MAPT
Cyanide SCHEMBL30330027 0.61 INMT (0.37) INMTALDH1A1NPSR1
SCHEMBL22477559 0.61 ALDH1A1 (0.33) ALDH1A1NPSR1
SCHEMBL25477352 0.60 MEN1 (0.32) ALDH1A1NPSR1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9389507-B2 Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition FUJIFILM CORPORATION (JP) 2016-07-12 — — US disclosed
US-20140255846-A1 POLYMERIZABLE COMPOSITION, AND PHOTOSENSITIVE LAYER, PERMANENT PATTERN, WAFER-LEVEL LENS, SOLID-STATE IMAGING DEVICE AND PATTERN FORMING METHOD EACH USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2014-09-11 — — US disclosed
US-8766388-B2 Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition FUJIFILM CORPORATION (JP) 2014-07-01 — — US disclosed
US-8728712-B2 Polymerizable composition FUJIFILM CORPORATION (JP) 2014-05-20 — — US disclosed
US-20130143164-A1 POLYMERIZABLE COMPOSITION FUJIFILM CORPORATION (JP) 2013-06-06 — — US disclosed
US-20120068292-A1 POLYMERIZABLE COMPOSITION, AND PHOTOSENSITIVE LAYER, PERMANENT PATTERN, WAFER-LEVEL LENS, SOLID-STATE IMAGING DEVICE AND PATTERN FORMING METHOD EACH USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2012-03-22 — — US disclosed
US-20100143616-A1 HEAT-SENSITIVE TRANSFER IMAGE-RECEIVING SHEET AND METHOD OF PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2010-06-10 — — US disclosed
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