SCHEMBL8028645

SCHEMBL8028645

CCOc1ccc2c(C)c3ccc(OCC)cc3nc2c1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 6/20 0.55
MEN1 O00255 4/20 0.55
LMNA P02545 2/20 0.55
BLM P54132 2/20 0.55
TERT O14746 1/20 0.55
ABCB11 O95342 1/20 0.55
THRB P10828 1/20 0.55
MAPT P10636 5/20 0.53
KDM4E B2RXH2 5/20 0.48
ALDH1A1 P00352 5/20 0.48
HSD17B10 Q99714 5/20 0.48
HPGD P15428 3/20 0.48
TSHR P16473 3/20 0.48
CYP1A2 P05177 1/20 0.48
SMN1; SMN2 Q16637 1/20 0.48
NQO1 P15559 1/20 0.46
TP53 P04637 2/20 0.45
RAD52 P43351 2/20 0.45
STAT3 P40763 1/20 0.45
HIF1A Q16665 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20856476 0.78 MEN1 (0.86) KMT2AMEN1LMNABLMTERT
SCHEMBL29566948 0.77 MAOA (0.55) KMT2AMEN1LMNABLMTERT
SCHEMBL29091606 0.76 KMT2A (0.48) KMT2AMEN1LMNABLMTERT
SCHEMBL22529646 0.76 KMT2A (0.63) KMT2AMEN1LMNABLMTERT
SCHEMBL11694010 0.76 MAPT (0.54) KMT2AMEN1LMNABLMTERT
SCHEMBL27113171 0.75 CAMKK1 (0.47) KMT2AMEN1LMNABLMTERT
SCHEMBL5237941 0.75 GRM4 (0.48) KMT2AMEN1LMNABLMTERT
SCHEMBL13737643 0.74 MAPT (0.53) KMT2AMEN1MAPTKDM4EALDH1A1
SCHEMBL18417197 0.74 NQO1 (0.56) KMT2AMEN1LMNABLMTERT
SCHEMBL28925144 0.74 HSD17B10 (0.55) KMT2AMEN1LMNABLMTERT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6156870-A Resin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring board HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-12-05 US claimed
US-6156870-A Resin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring board HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-12-05 US disclosed