Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | IAPP | P10997 | 3/20 | 0.36 |
| ▸ | CNR2 | P34972 | 1/20 | 0.36 |
| ▸ | GAA | P10253 | 1/20 | 0.36 |
| ▸ | XBP1 | P17861 | 1/20 | 0.36 |
| ▸ | ATM | Q13315 | 1/20 | 0.36 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.36 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.36 |
| ▸ | ELANE | P08246 | 1/20 | 0.36 |
| ▸ | CTRC | Q99895 | 1/20 | 0.36 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
| ▸ | MAPT | P10636 | 1/20 | 0.36 |
| ▸ | HPGD | P15428 | 1/20 | 0.36 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.36 |
| ▸ | RECQL | P46063 | 1/20 | 0.36 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.36 |
| ▸ | LMNA | P02545 | 2/20 | 0.35 |
| ▸ | TRPV1 | Q8NER1 | 1/20 | 0.34 |
| ▸ | BID | P55957 | 1/20 | 0.33 |
| ▸ | BCL2L1 | Q07817 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7772658 | 0.95 | CNR2 (0.38) | IAPPCNR2ATMALDH1A1MAPT | |
| SCHEMBL8663788 | 0.84 | GPR84 (0.42) | CNR2MAPTBIDBCL2L1MCL1 | |
| SCHEMBL9620395 | 0.84 | GPR84 (0.42) | CNR2MAPTBIDBCL2L1MCL1 | |
| SCHEMBL9419226 | 0.78 | HTT (0.47) | KDM4EMAPTALOX15 | |
| SCHEMBL10707896 | 0.77 | CYSLTR2 (0.36) | ADRB2 | |
| SCHEMBL3650269 | 0.77 | TSHR (0.35) | IAPPCNR2GAAXBP1ATM | |
| SCHEMBL9158036 | 0.75 | TYR (0.42) | CNR2 | |
| SCHEMBL7855809 | 0.73 | HTT (0.50) | KDM4EALDH1A1MAPTHPGDALOX15 | |
| SCHEMBL27890121 | 0.73 | TSHR (0.37) | IAPPGAAXBP1ATMNPSR1 | |
| SCHEMBL3657561 | 0.72 | TYR (0.34) | IAPPCNR2MAPTTRPV1ADRB2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250376552-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-12-11 | — | — | US | disclosed |
| EP-4596608-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-20250236697-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-24 | — | — | US | disclosed |
| WO-2024053655-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-14 | — | — | WO | disclosed |
| WO-2024048436-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2024048603-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2024048605-A1 | RESIN COMPOSITION, CURED PRODUCT, LAYERED BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAYERED BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2024048604-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2024048435-A1 | RESIN COMPOSITION, CURED ARTICLE, LAMINATE, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2022202647-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-09-29 | — | — | WO | disclosed |
| EP-0745575-B1 | Method of synthesizing polyphenol compound and positive working photoresist composition comprising polyphenol compound | FUJI PHOTO FILM CO LTD (JP) | 2000-09-06 | — | — | EP | disclosed |
| EP-0753795-B1 | Positive working photoresist composition | FUJI PHOTO FILM CO LTD (JP) | 1999-10-13 | — | — | EP | disclosed |
| EP-0764884-B1 | Positive working photoresist composition | FUJI PHOTO FILM CO LTD (JP) | 1999-09-01 | — | — | EP | disclosed |
| US-5853949-A | Method of synthesizing polyphenol compound and positive working photoresist composition comprising polyphenol compound | FUJI PHOTO FILM CO., LTD. (JP) | 1998-12-29 | — | — | US | disclosed |
| US-5709977-A | Positive working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1998-01-20 | — | — | US | disclosed |
| US-5652081-A | PHENOLIC RESIN | FUJI PHOTO FILM CO., LTD. (JP) | 1997-07-29 | — | — | US | disclosed |
| EP-0764884-A2 | Positive working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1997-03-26 | — | — | EP | disclosed |
| EP-0753795-A1 | Positive working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1997-01-15 | — | — | EP | disclosed |
| EP-0745575-A1 | Method of synthesizing polyphenol compound and positive working photoresist composition comprising polyphenol compound | FUJI PHOTO FILM CO., LTD. (JP) | 1996-12-04 | — | — | EP | disclosed |