SCHEMBL809702

SCHEMBL809702

CC/C(C(=O)[O-])=C(\CC)C(=O)[O-].CCCCCCCC[Sn+2]CCCCCCCC

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES2 O00748 4/20 0.41
CES1 P23141 4/20 0.41
FABP3 P05413 6/20 0.39
CA2 P00918 1/20 0.37
PPARG P37231 4/20 0.35
PPARD Q03181 4/20 0.35
PPARA Q07869 4/20 0.35
TSHR P16473 3/20 0.35
GPR84 Q9NQS5 3/20 0.35
HDAC11 Q96DB2 3/20 0.35
ALDH1A1 P00352 2/20 0.35
TDP1 Q9NUW8 2/20 0.35
SLC22A6 Q4U2R8 1/20 0.35
SLC22A8 Q8TCC7 1/20 0.35
TLR2 O60603 1/20 0.35
MEN1 O00255 1/20 0.35
ESR1 P03372 1/20 0.35
FABP4 P15090 1/20 0.35
ALOX15 P16050 1/20 0.35
PTPN1 P18031 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5157563 1.00 CES2 (0.41) CES2CES1FABP3CA2PPARG
SCHEMBL674251 0.92 CA1 (0.38) CES2CES1FABP3CA2
SCHEMBL477424 0.92 CA1 (0.38) CES2CES1FABP3CA2
SCHEMBL3767401 0.89 CES2 (0.45) CES2CES1FABP3PPARGPPARD
SCHEMBL3767406 0.89 CES2 (0.45) CES2CES1FABP3PPARGPPARD
Oxalic Acid SCHEMBL10749415 0.87 CES2 (0.48) CES2CES1FABP3CA2PPARG
SCHEMBL383230 0.86 CES2 (0.50) CES2CES1FABP3PPARGPPARD
SCHEMBL5266747 0.86 CES2 (0.50) CES2CES1FABP3PPARGPPARD
SCHEMBL5266753 0.86 CES2 (0.50) CES2CES1FABP3PPARGPPARD
SCHEMBL383228 0.86 CES2 (0.50) CES2CES1FABP3PPARGPPARD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 88 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0863165-B1 Method of producing conjugated diene polymers JSR CORP (JP) 2003-06-04 EP claimed
EP-4720168-A1 METHOD OF PREPARING A MOISTURE CURABLE RESIN COMPOSITION Kaneka Americas Holding, Inc. (US) 2026-04-08 EP disclosed
US-12448479-B2 Radiation curable and printable composition HENKEL AG & CO. KGAA (DE) 2025-10-21 US disclosed
EP-3931237-B1 MOISTURE CURABLE ADHESIVE COMPOSITIONS KANEKA AMERICAS HOLDING INC (US) 2025-08-20 EP disclosed
US-12391853-B2 Adhesive formulations for roofing applications and related methods BMIC LLC (US) 2025-08-19 US disclosed
US-20250179272-A1 REMOVABLE ADHESIVE AND SEALANT COMPOSITION HENKEL AG & CO. KGAA (DE) 2025-06-05 US disclosed
WO-2025111365-A1 METHOD OF PREPARING A MOISTURE CURABLE RESIN COMPOSITION WITH A NON-TIN CATALYST KANEKA AMERICAS HOLDING, INC. (US) 2025-05-30 WO disclosed
EP-4324892-B1 REMOVABLE ADHESIVE AND SEALANT COMPOSITION HENKEL AG & CO KGAA (DE) 2025-04-16 EP disclosed
WO-2025075042-A1 TWO-PACK TYPE CURABLE COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
CN-114127156-B Moisture curable adhesive composition 钟化美洲控股公司 2025-01-21 CN disclosed
WO-2008071461-A1 PREPOLYMER MIXTURE CONTAINING SILYL GROUPS AND USE THEREOF HENKEL AG & CO. KGAA (DE) 2008-06-19 WO disclosed
EP-1471113-B1 Curable composition KANEKA CORP (JP) 2007-08-15 EP disclosed
US-7176269-B2 Curable composition and its use MITSUI CHEMICALS, INC. (JP) 2007-02-13 US disclosed
EP-1304354-B1 CURABLE COMPOSITION AND USES THEREOF MITSUI CHEMICALS INC (JP) 2007-01-24 EP disclosed
US-20070015893-A1 Curable composition and its use MITSUI CHEMICALS, INC. 2007-01-18 US disclosed
US-7019074-B2 Curable composition KANEKA CORPORATION (JP) 2006-03-28 US disclosed
US-20040214950-A1 Curable composition KANEKA CORPORATION (JP) 2004-10-28 US disclosed
EP-1471113-A1 Curable composition Kaneka Corporation (JP) 2004-10-27 EP disclosed
US-20030096904-A1 Curable composition and its use MITSUI CHEMICALS, INC. (JP) 2003-05-22 US disclosed
EP-1304354-A1 CURABLE COMPOSITION AND USES THEREOF Mitsui Chemicals, Inc. (JP) 2003-04-23 EP disclosed