SCHEMBL674251

SCHEMBL674251

CCC(C(=O)[O-])=C(CC)C(=O)[O-].CCCC[Sn+2]CCCC

nearest known ligand 0.43

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
CA1 P00915 3/20 0.38
CES1 P23141 6/20 0.37
CES2 O00748 5/20 0.37
FABP3 P05413 3/20 0.33
CA2 P00918 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL477424 1.00 CA1 (0.38) CA1CES1CES2FABP3CA2
SCHEMBL809702 0.92 CES2 (0.41) CES1CES2FABP3CA2
SCHEMBL5157563 0.92 CES2 (0.41) CES1CES2FABP3CA2
SCHEMBL3767401 0.89 CES2 (0.45) CES1CES2FABP3
SCHEMBL3767406 0.89 CES2 (0.45) CES1CES2FABP3
Oxalic Acid SCHEMBL4020981 0.86 CA1 (0.44) CA1CES1CES2FABP3CA2
SCHEMBL477352 0.85 CA1 (0.46) CA1CES1CES2FABP3
SCHEMBL825263 0.85 CA1 (0.46) CA1CES1CES2FABP3
Propionic Acid SCHEMBL8359110 0.84 CA1 (0.48) CA1CES1CES2FABP3CA2
Bicarbonate SCHEMBL27704869 0.84 CA1 (0.46) CA1CES1CES2CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 192 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4720168-A1 METHOD OF PREPARING A MOISTURE CURABLE RESIN COMPOSITION Kaneka Americas Holding, Inc. (US) 2026-04-08 EP disclosed
US-12448479-B2 Radiation curable and printable composition HENKEL AG & CO. KGAA (DE) 2025-10-21 US disclosed
EP-3931237-B1 MOISTURE CURABLE ADHESIVE COMPOSITIONS KANEKA AMERICAS HOLDING INC (US) 2025-08-20 EP disclosed
US-12391853-B2 Adhesive formulations for roofing applications and related methods BMIC LLC (US) 2025-08-19 US disclosed
US-20250179272-A1 REMOVABLE ADHESIVE AND SEALANT COMPOSITION HENKEL AG & CO. KGAA (DE) 2025-06-05 US disclosed
WO-2025111365-A1 METHOD OF PREPARING A MOISTURE CURABLE RESIN COMPOSITION WITH A NON-TIN CATALYST KANEKA AMERICAS HOLDING, INC. (US) 2025-05-30 WO disclosed
EP-4324892-B1 REMOVABLE ADHESIVE AND SEALANT COMPOSITION HENKEL AG & CO KGAA (DE) 2025-04-16 EP disclosed
CN-114127156-B Moisture curable adhesive composition 钟化美洲控股公司 2025-01-21 CN disclosed
US-12163043-B2 Curable composition comprising polysiloxane polyalkyleneglycol brush copolymers HENKEL AG & CO. KGAA (DE) 2024-12-10 US disclosed
WO-2024249895-A1 METHOD OF PREPARING A MOISTURE CURABLE RESIN COMPOSITION KANEKA AMERICAS HOLDING, INC. (US) 2024-12-05 WO disclosed
EP-1304354-A1 CURABLE COMPOSITION AND USES THEREOF Mitsui Chemicals, Inc. (JP) 2003-04-23 EP disclosed
CN-1392890-A Curable composition and use thereof MITSUI CHEMICALS INC (JP) 2003-01-22 CN disclosed
US-6451439-B2 A PRIMER COMPRISES, AS COMPONENT, A SATURATED HYDROCARBON POLYMER HAVING ATLEAST ONE-SILICON CONTAINING GROUP WHICH HAS A HYDROXY GROUP OR HYDROLYZABLE GROUP BOUND TO SILICON ATOM AND IS CAPABLE OF CROSSLINKING KANEKA CORPORATION (JP) 2002-09-17 US disclosed
US-20010047056-A1 Primer composition and method of effecting adhesion for sealing compositions KANEKA CORPORATION (JP) 2001-11-29 US disclosed
EP-0627472-B1 Curable composition KANEGAFUCHI CHEMICAL IND (JP) 2000-03-08 EP disclosed
US-6025445-A CROSSLINKABLE; POLYSILOXANES; DIALKYLTIN DIALKOXIDE AND HYDRATED METAL SALT CURING AGENT; STORAGE STABILITY KANEKA CORPORATION (JP) 2000-02-15 US disclosed
EP-0931821-A2 Primer composition and method of effecting adhesion for sealing compositions KANEKA CORPORATION (JP) 1999-07-28 EP disclosed
EP-0839872-A2 Curable polymer having reactive silicon-containing functional groups KANEKA CORPORATION (JP) 1998-05-06 EP disclosed
US-5399601-A Overcoatings KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1995-03-21 US disclosed
EP-0627472-A2 Curable composition KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1994-12-07 EP disclosed