SCHEMBL812276

SCHEMBL812276

[CH2]C(O)COC(C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4926269 0.77 ALDH1A1 (0.36)
SCHEMBL1982314 0.77 MAPK1 (0.65)
SCHEMBL7604167 0.77
SCHEMBL35599 0.74
SCHEMBL1040994 0.74
SCHEMBL58586 0.74
SCHEMBL2087163 0.74
SCHEMBL19415051 0.72
SCHEMBL13203576 0.72 MAPK1 (0.59)
SCHEMBL9309371 0.72 MAPK1 (0.59)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110028670-A Low-dielectric loss negative light-sensitive poly amic acid ester resin, resin combination, preparation method and application 明士新材料有限公司 2019-07-19 CN claimed
CN-116323755-A Resin composition, cured film, insulating film or protective film, antenna element, electronic component, display device or semiconductor device, and method for producing same 东丽株式会社 2023-06-23 CN disclosed
CN-115542668-A Photosensitive resin composition 东京应化工业株式会社 2022-12-30 CN disclosed
CN-114207520-A Photosensitive resin composition, photosensitive sheet, cured film, method for producing cured film, interlayer insulating film, and electronic component 东丽株式会社 2022-03-18 CN disclosed
CN-112368641-A Photosensitive resin composition, photosensitive sheet, cured film of photosensitive resin composition and photosensitive sheet, method for producing cured film, and electronic component 东丽株式会社 2021-02-12 CN disclosed
US-8765728-B2 [1,5]-diazocin derivatives MELLITECH (FR) 2014-07-01 US disclosed
CN-102375336-B Manufacturing method of photosensitive resin composition and solidified embossing pattern, and semiconductor device ASAHI KASEI E MATERIALS CORP 2013-10-09 CN disclosed
CN-102162996-B Manufacture method for negative type photosensitive resin composition and cured relief pattern ASAHI KASEI E MATERIALS CORP 2013-07-17 CN disclosed
EP-1120407-B1 Cystine derivatives AJINOMOTO KK (JP) 2013-02-20 EP disclosed
CN-102812011-A [1,5] -diazacyclo-octatetraene derivative MELLITECH 2012-12-05 CN disclosed
US-20040156802-A1 Cosmetics or external preparations for skin AJINOMOTO CO., INC. (JP) 2004-08-12 US disclosed
US-6703031-B1 OXIDATIVE STRESS INHIBITOR; RETARDING AGING OF SKIN AJINOMOTO CO., INC. (JP) 2004-03-09 US disclosed
EP-1374831-A1 COMSETICS OR EXTERNAL PREPARAIOTNS FOR SKIN Ajinomoto Co., Inc. (JP) 2004-01-02 EP disclosed
US-20030194417-A1 Cysteine derivatives AJINOMOTO CO. INC (JP) 2003-10-16 US disclosed
US-6602492-B2 Cysteine derivatives AJINOMOTO CO., INC. (JP) 2003-08-05 US disclosed
US-20020115723-A1 Cysteine derivatives AJINOMOTO CO., INC. (JP) 2002-08-22 US disclosed
CN-1341119-A Melanocyte-stimulating hormone inhibitors AJINOMOTO KK (JP) 2002-03-20 CN disclosed
EP-1174437-A1 MELANOCYTE-STIMULATING HORMONE INHIBITORS Ajinomoto Co., Inc. (JP) 2002-01-23 EP disclosed
CN-1315940-A Cysteine derivatives AJINOMOTO KK (JP) 2001-10-03 CN disclosed
EP-1120407-A1 CYSTEINE DERIVATIVES Ajinomoto Co., Inc. (JP) 2001-08-01 EP disclosed