1,4-Butanediol

1,4-Butanediol

SCHEMBL8126371

C/C=C\O/C=C\C.OCCCCO

nearest known ligand 0.38

Full drug profile on Sugi Atlas →

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 1/20 0.38
LMNA P02545 2/20 0.36
ALDH1A1 P00352 2/20 0.36
HSD17B10 Q99714 1/20 0.36
MEN1 O00255 1/20 0.36
KMT2A Q03164 1/20 0.36
TSHR P16473 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
1,4-Butanediol SCHEMBL5927815 1.00 SMN1; SMN2 (0.38) SMN1; SMN2LMNAALDH1A1HSD17B10MEN1
1,6-Hexanediol SCHEMBL5611536 0.97 LMNA (0.41) SMN1; SMN2LMNAALDH1A1HSD17B10MEN1
1,6-Hexanediol SCHEMBL5611532 0.97 LMNA (0.41) SMN1; SMN2LMNAALDH1A1HSD17B10MEN1
1,3-Propanediol SCHEMBL5927829 0.94 ALDH1A1 (0.33) SMN1; SMN2LMNAALDH1A1HSD17B10MEN1
Ethylene Glycol SCHEMBL9436952 0.88 TSHR (0.33) TSHR
Ethylene Glycol SCHEMBL5612095 0.88 TSHR (0.33) TSHR
Ethylene Glycol SCHEMBL27425654 0.88 TSHR (0.33) TSHR
Ethylene Glycol SCHEMBL5611801 0.80
Ethylene Glycol SCHEMBL1476998 0.80
Ethylene Glycol SCHEMBL5611756 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2813892-B1 Photoresist underlayer film-forming composition and pattern forming processes SHINETSU CHEMICAL CO (JP) 2020-06-17 EP disclosed
US-10228621-B2 Underlayer film-forming composition and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-03-12 US disclosed
EP-2813890-B1 Photoresist underlayer film-forming composition and pattern forming processes SHINETSU CHEMICAL CO (JP) 2018-05-30 EP disclosed
EP-2813889-B1 Photoresist underlayer film-forming composition and pattern forming process SHINETSU CHEMICAL CO (JP) 2018-02-07 EP disclosed
EP-2813891-B1 Photoresist underlayer film-forming composition and pattern forming process SHINETSU CHEMICAL CO (JP) 2018-01-17 EP disclosed
US-9620363-B2 Underlayer film-forming composition and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-04-11 US disclosed
US-9136121-B2 Underlayer film-forming composition and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-09-15 US disclosed
US-9136122-B2 Underlayer film-forming composition and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-09-15 US disclosed
EP-2813892-A2 Photoresist underlayer film-forming composition and pattern forming process Shin-Etsu Chemical Co., Ltd. (JP) 2014-12-17 EP disclosed
EP-2813890-A2 Photoresist underlayer film-forming composition and pattern forming process Shin-Etsu Chemical Co., Ltd. (JP) 2014-12-17 EP disclosed
EP-2813889-A2 Photoresist underlayer film-forming composition and pattern forming process Shin-Etsu Chemical Co., Ltd. (JP) 2014-12-17 EP disclosed
EP-2813891-A2 Photoresist underlayer film-forming composition and pattern forming process Shin-Etsu Chemical Co., Ltd. (JP) 2014-12-17 EP disclosed
US-20140363958-A1 UNDERLAYER FILM-FORMING COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-12-11 US disclosed
US-20140363957-A1 UNDERLAYER FILM-FORMING COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-12-11 US disclosed
US-20140363955-A1 UNDERLAYER FILM-FORMING COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-12-11 US disclosed
US-20140363956-A1 UNDERLAYER FILM-FORMING COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-12-11 US disclosed
US-6048661-A POLYMER WITH HYDROXY AND CARBOXY GROUPS AND ETHER ESTER GROUPS FOR PHOTORESISTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-04-11 US disclosed