SCHEMBL813710

SCHEMBL813710

Cc1ccccc1NC(=O)NC1CCCCC1

nearest known ligand 0.79

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.79
SMN1; SMN2 Q16637 3/20 0.79
MEN1 O00255 1/20 0.79
HTT P42858 1/20 0.79
EPHX1 P07099 3/20 0.70
RAB9A P51151 3/20 0.68
NPC1 O15118 2/20 0.68
KDM4E B2RXH2 3/20 0.66
TSHR P16473 2/20 0.66
TP53 P04637 1/20 0.65
PKM P14618 1/20 0.64
EPHX2 P34913 2/20 0.64
ALDH1A1 P00352 1/20 0.63
TDP1 Q9NUW8 1/20 0.61
MAPT P10636 1/20 0.59

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2751737 0.98 KMT2A (0.76) KMT2ASMN1; SMN2MEN1HTTEPHX1
SCHEMBL6439308 0.89 KMT2A (1.00) KMT2ASMN1; SMN2MEN1HTTEPHX1
SCHEMBL2751413 0.86 SMN1; SMN2 (0.72) KMT2ASMN1; SMN2MEN1HTTEPHX1
SCHEMBL12196131 0.83 EPHX1 (1.00) KMT2ASMN1; SMN2MEN1HTTEPHX1
SCHEMBL6156020 0.81 GAA (0.55) KMT2ASMN1; SMN2MEN1HTTEPHX1
SCHEMBL11336178 0.81 RAB9A (1.00) KMT2ASMN1; SMN2MEN1HTTEPHX1
SCHEMBL7597346 0.81 KMT2A (0.79) KMT2ASMN1; SMN2MEN1HTTEPHX1
SCHEMBL28651774 0.81 KMT2A (0.79) KMT2ASMN1; SMN2MEN1HTTEPHX1
SCHEMBL1514659 0.81 EPHX1 (0.83) KMT2ASMN1; SMN2MEN1HTTEPHX1
SCHEMBL2752767 0.81 EPHX1 (0.97) KMT2ASMN1; SMN2MEN1HTTEPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10030138-B2 High thermal conductivity thermoplastic resin composition with excellent injection moldability KANEKA CORPORATION (JP) 2018-07-24 US disclosed
EP-2050790-B1 BIODEGRADABLE RESIN COMPOSITION AND MOLDED BODY THEREOF KANEKA CORP (JP) 2018-06-13 EP disclosed
US-20160152823-A1 HIGH THERMAL CONDUCTIVITY THERMOPLASTIC RESIN COMPOSITION WITH EXCELLENT INJECTION MOLDABILITY KANEKA CORPORATION (JP) 2016-06-02 US disclosed
EP-3018172-A1 HIGH THERMAL CONDUCTIVITY THERMOPLASTIC RESIN COMPOSITION WITH EXCELLENT INJECTION MOLDABILITY Kaneka Corporation (JP) 2016-05-11 EP disclosed
EP-1881036-B1 BIODEGRADABLE RESIN COMPOSITION AND MOLDED ARTICLE PRODUCED FROM THE SAME KANEKA CORP (JP) 2015-04-15 EP disclosed
US-20130202882-A1 HIGHLY THERMALLY CONDUCTIVE RESIN MOLDED ARTICLE, AND MANUFACTURING METHOD FOR SAME KANEKA CORPORATION (JP) 2013-08-08 US disclosed
US-8394489-B2 Highly thermally conductive resin molded article KANEKA CORPORATION (JP) 2013-03-12 US disclosed
EP-1994798-A4 TRANSVERSE FLUX ELECTRIC INDUCTORS INDUCTOTHERM CORP (US) 2011-11-23 EP disclosed
US-8053491-B2 Biodegradable resin composition and molded article of the same KANEKA CORPORATION (JP) 2011-11-08 US disclosed
US-7973101-B2 Biodegradable resin composition and molded article produced from the same KANEKA CORPORATION (JP) 2011-07-05 US disclosed
US-20110027565-A1 HIGHLY THERMALLY CONDUCTIVE RESIN MOLDED ARTICLE KANEKA CORPORATION (JP) 2011-02-03 US disclosed
EP-1881035-B1 BIODEGRADABLE RESIN COMPOSITION AND MOLDED ARTICLE PRODUCED FROM THE SAME KANEKA CORP (JP) 2010-09-08 EP disclosed
US-20100041791-A1 BIODEGRADABLE RESIN COMPOSITION AND MOLDED ARTICLE OF THE SAME KANEKA CORPORATION (JP) 2010-02-18 US disclosed
US-20090111921-A1 Biodegradable Resin Composition and Molded Article Produced From The Same KANEKA CORPORATION (JP) 2009-04-30 US disclosed
EP-2050790-A1 BIODEGRADABLE RESIN COMPOSITION AND MOLDED BODY THEREOF Kaneka Corporation (JP) 2009-04-22 EP disclosed
US-20090076191-A1 BIODEGRADABLE RESIN COMPOSITION AND MOLDED ARTICLE PRODUCED FROM THE SAME KANEKA CORPORATION (JP) 2009-03-19 US disclosed
US-20080033077-A1 Biodegradable Resin Compositions and Molded Objects Thereof KANEKA CORPORATION (JP) 2008-02-07 US disclosed
EP-1881036-A1 BIODEGRADABLE RESIN COMPOSITION AND MOLDED ARTICLE PRODUCED FROM THE SAME Kaneka Corporation (JP) 2008-01-23 EP disclosed
EP-1881035-A1 BIODEGRADABLE RESIN COMPOSITION AND MOLDED ARTICLE PRODUCED FROM THE SAME Kaneka Corporation (JP) 2008-01-23 EP disclosed
EP-1826241-A1 BIODEGRADABLE RESIN COMPOSITIONS AND MOLDED OBJECTS THEREOF Kaneka Corporation (JP) 2007-08-29 EP disclosed