SCHEMBL8138563

SCHEMBL8138563

O=C(OC1=CCCCC1)c1ccc(C(=O)OC2=CCCCC2)cc1

nearest known ligand 0.56

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 5/20 0.39
MAPT P10636 4/20 0.39
SMN1; SMN2 Q16637 4/20 0.39
ALDH1A1 P00352 4/20 0.37
HPGD P15428 3/20 0.37
HDAC4 P56524 1/20 0.36
HDAC2 Q92769 1/20 0.36
HDAC8 Q9BY41 1/20 0.36
HDAC6 Q9UBN7 1/20 0.36
NPC1 O15118 3/20 0.35
RAB9A P51151 3/20 0.35
LMNA P02545 1/20 0.35
ALOX12 P18054 1/20 0.35
NFKB1 P19838 1/20 0.35
NFKB2 Q00653 1/20 0.35
RELA Q04206 1/20 0.35
MEN1 O00255 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6353529 0.91 KMT2A (0.51) KMT2AMAPTSMN1; SMN2ALDH1A1LMNA
SCHEMBL25437291 0.87 SMN1; SMN2 (0.50) KMT2AMAPTSMN1; SMN2ALDH1A1HPGD
SCHEMBL8132876 0.86 MAPK1 (0.41) KMT2AMAPTSMN1; SMN2ALDH1A1HPGD
SCHEMBL10663480 0.85 ALDH1A1 (0.33) KMT2AMAPTSMN1; SMN2ALDH1A1HPGD
SCHEMBL9341204 0.85 KMT2A (0.49) KMT2AMAPTSMN1; SMN2ALDH1A1LMNA
SCHEMBL30445485 0.83 CA1 (0.51) KMT2AMAPTSMN1; SMN2ALDH1A1HPGD
SCHEMBL8140023 0.81 KDM4E (0.39) KMT2AMAPTSMN1; SMN2ALDH1A1HPGD
SCHEMBL9011880 0.81 HDAC2 (0.48) MAPTALDH1A1HDAC4HDAC2HDAC8
SCHEMBL30445785 0.81 KMT2A (0.51) KMT2AMAPTSMN1; SMN2ALDH1A1NPC1
SCHEMBL9824084 0.80 ALDH1A1 (0.34) KMT2AMAPTSMN1; SMN2ALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12479971-B2 Conductive paste composition containing silver-coated copper nanowires with core-shell structure and conductive film comprising the same BIONEER CORPORATION (KR) 2025-11-25 US disclosed
EP-4020499-B1 CONDUCTIVE PASTE COMPOSITION COMPRISING SILVER-COATED COPPER NANOWIRE WITH CORE-SHELL STRUCTURE AND CONDUCTIVE FILM COMPRISING SAME BIONEER CORP (KR) 2025-03-19 EP disclosed
CN-220672602-U LED support and LED packaging structure 东莞市福日源磊科技有限公司 2024-03-26 CN disclosed
CN-117678332-A Electromagnetic shielding composition containing metals having different forms 株式会社百奥尼 2024-03-08 CN disclosed
CN-117678035-A Metal nanowires with core-shell structure 株式会社百奥尼 2024-03-08 CN disclosed
US-20230011343-A1 CONDUCTIVE PASTE COMPOSITION CONTAINING SILVER-COATED COPPER NANOWIRES WITH CORE-SHELL STRUCTURE AND CONDUCTIVE FILM COMPRISING THE SAME BIONEER CORPORATION (KR) 2023-01-12 US disclosed
EP-4020499-A1 CONDUCTIVE PASTE COMPOSITION COMPRISING SILVER-COATED COPPER NANOWIRE WITH CORE-SHELL STRUCTURE AND CONDUCTIVE FILM COMPRISING SAME Bioneer Corporation (KR) 2022-06-29 EP disclosed
CN-1486375-A Thermoplastic compositions for fiber and film production 陶氏环球技术公司 2004-03-31 CN disclosed
CN-1105013-C Sheet formed from polyester including isosorbide DU PONT (US) 2003-04-09 CN disclosed
CN-1377256-A Personal care articles PROCTER & GAMBLE (US) 2002-10-30 CN disclosed
CN-1298346-A Sheet formed from polyester including isosorbide DU PONT (US) 2001-06-06 CN disclosed
EP-0989162-A1 THERMOPLASTIC RESIN COMPOSITION, WATER-BASED COMPOSITION, HEAT-SENSITIVE PRESSURE-SENSITIVE ADHESIVE, AND HEAT-SENSITIVE SHEET Daicel Chemical Industries, Ltd. (JP) 2000-03-29 EP disclosed
WO-1989011507-A1 THERMOPLASTIC POLYESTER/ELASTOMER GRAFTED BLENDS ALLIED-SIGNAL INC. (US) 1989-11-30 WO disclosed
US-4096202-A Impact modified poly(alkylene terephthalates) ROHM AND HAAS COMPANY (US) 1978-06-20 US disclosed