SCHEMBL814218

SCHEMBL814218

C=CC1OC1CCCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7033921 0.93 TSHR (0.39)
SCHEMBL15093177 0.93 TSHR (0.39)
SCHEMBL13863985 0.91 TSHR (0.43)
SCHEMBL4447210 0.91 TSHR (0.43)
SCHEMBL8782117 0.91 TSHR (0.43)
SCHEMBL4447205 0.91 TSHR (0.43)
SCHEMBL4447204 0.91 TSHR (0.43)
SCHEMBL28596274 0.83 TSHR (0.45)
SCHEMBL27692084 0.83 ALDH1A1 (0.30)
SCHEMBL9379030 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113574117-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2023-09-12 CN disclosed
CN-113574116-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2023-02-28 CN disclosed
CN-115151611-A Curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-10-04 CN disclosed
CN-107431013-B Etching mask, etching mask precursor, method for manufacturing oxide layer, and method for manufacturing thin film transistor 国立大学法人北陆先端科学技术大学院大学 2022-01-25 CN disclosed
CN-113574116-A Curable composition, cured product, and method for using curable composition 琳得科株式会社 2021-10-29 CN disclosed
CN-113574117-A Curable composition, cured product, and method for using curable composition 琳得科株式会社 2021-10-29 CN disclosed
CN-108473767-B Curable composition, method for producing curable composition, cured product, and method for using curable composition 琳得科株式会社 2021-07-13 CN disclosed
EP-3292160-B1 COATING COMPOSITIONS SHERWIN WILLIAMS CO (US) 2019-03-13 EP disclosed
CN-107820510-A Coating composition 晓温-威廉姆斯公司 2018-03-20 CN disclosed
EP-3292160-A1 COATING COMPOSITIONS The Sherwin-Williams Company (US) 2018-03-14 EP disclosed
US-20040127680-A1 Vinyl ester adhesive compositions ILLINOIS TOOL WORKS INC. (US) 2004-07-01 US disclosed
EP-1424378-A2 Curable adhesive compositions containing reactive multi-functional acrylate Illinois Tool Works, Inc. (US) 2004-06-02 EP disclosed
EP-1424379-A2 Vinyl ester adhesive compositions ILLINOIS TOOL WORKS INC. (US) 2004-06-02 EP disclosed
CN-1486349-A Radiation curable compositions DSM 2004-03-31 CN disclosed
CN-1446183-A Coated optical fiber and radiation curable resin composition DSM NV (NL) 2003-10-01 CN disclosed
EP-1170331-A1 CROSSLINKABLE RUBBER COMPOSITION NIPPON ZEON CO., LTD. (JP) 2002-01-09 EP disclosed
US-6274687-B1 EMULSION POLYMERIZATION DAISO CO., LTD. (JP) 2001-08-14 US disclosed
CN-1249716-A Adhesive system for one-step or multi-step adhesive binding, and method for adhesive binding of printed matter HENKEL KGAA (DE) 2000-04-05 CN disclosed
US-5756600-A Urethane-modified epoxy vinyl ester resin TAKEDA CHEMICAL INDUSTRIES, LTD. (JP) 1998-05-26 US disclosed
EP-0515142-B1 Optically active epoxides and a process for the production thereof CHISSO CORP (JP) 1996-10-23 EP disclosed