Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.64 |
| ▸ | GLA | P06280 | 1/20 | 0.64 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.55 |
| ▸ | TP53 | P04637 | 3/20 | 0.49 |
| ▸ | TSHR | P16473 | 3/20 | 0.49 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.49 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.49 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.49 |
| ▸ | MEN1 | O00255 | 2/20 | 0.46 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.46 |
| ▸ | MAPT | P10636 | 2/20 | 0.44 |
| ▸ | HPGD | P15428 | 2/20 | 0.44 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.44 |
| ▸ | PPARG | P37231 | 1/20 | 0.44 |
| ▸ | PKM | P14618 | 3/20 | 0.40 |
| ▸ | ADRB2 | P07550 | 1/20 | 0.40 |
| ▸ | HTR1A | P08908 | 1/20 | 0.40 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.40 |
| ▸ | HTR2A | P28223 | 1/20 | 0.40 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL80170 | 0.86 | ALDH1A1 (0.65) | ALDH1A1GLATDP1TP53TSHR | |
| SCHEMBL29847840 | 0.86 | ALDH1A1 (0.60) | ALDH1A1GLATDP1TP53TSHR | |
| SCHEMBL8695675 | 0.86 | ALDH1A1 (0.65) | ALDH1A1GLATDP1TP53TSHR | |
| SCHEMBL2905738 | 0.86 | ALDH1A1 (0.65) | ALDH1A1GLATDP1TP53TSHR | |
| SCHEMBL5514047 | 0.86 | ALDH1A1 (0.60) | ALDH1A1GLATDP1TP53TSHR | |
| SCHEMBL30033688 | 0.86 | ALDH1A1 (0.65) | ALDH1A1GLATDP1TP53TSHR | |
| SCHEMBL8695311 | 0.86 | ALDH1A1 (0.65) | ALDH1A1GLATDP1TP53TSHR | |
| SCHEMBL241150 | 0.86 | ALDH1A1 (0.65) | ALDH1A1GLATDP1TP53TSHR | |
| SCHEMBL1682297 | 0.85 | ALDH1A1 (0.58) | ALDH1A1GLATDP1TP53TSHR | |
| SCHEMBL679937 | 0.85 | ALDH1A1 (0.78) | ALDH1A1GLATDP1TP53TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6156865-A | Flame retardant thermosetting resin composition | NEC CORPORATION (JP) | 2000-12-05 | — | — | US | claimed |
| US-11624011-B2 | Thermosetting adhesive sheet and semiconductor device manufacturing method | LINTEC CORPORATION (JP) | 2023-04-11 | — | — | US | disclosed |
| WO-2019176554-A1 | UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME | デクセリアルズ株式会社 | 2019-09-19 | — | — | WO | disclosed |
| EP-3255658-B1 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND UNDERFILL FILM | DEXERIALS CORP (JP) | 2019-09-18 | — | — | EP | disclosed |
| US-10280347-B2 | Semiconductor device manufacturing method and underfill film | DEXERIALS CORPORATION (JP) | 2019-05-07 | — | — | US | disclosed |
| US-20180320031-A1 | THERMOSETTING ADHESIVE SHEET AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | DEXERIALS CORPORATION (JP) | 2018-11-08 | — | — | US | disclosed |
| US-20180079939-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND UNDERFILL FILM | DEXERIALS CORPORATION (JP) | 2018-03-22 | — | — | US | disclosed |
| US-9840645-B2 | Underfill material and method for manufacturing semiconductor device using the same | DEXERIALS CORPORATION (JP) | 2017-12-12 | — | — | US | disclosed |
| US-9691677-B2 | Underfill material and method for manufacturing semiconductor device using the same | DEXERIALS CORPORATION (JP) | 2017-06-27 | — | — | US | disclosed |
| US-20160017191-A1 | UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | DEXERIALS CORPORATION (JP) | 2016-01-21 | — | — | US | disclosed |
| US-20150348858-A1 | UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | DEXERIALS CORPORATION (JP) | 2015-12-03 | — | — | US | disclosed |
| US-6156865-A | Flame retardant thermosetting resin composition | NEC CORPORATION (JP) | 2000-12-05 | — | — | US | disclosed |