Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.56 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.56 |
| ▸ | HPGD | P15428 | 3/20 | 0.56 |
| ▸ | KCNA3 | P22001 | 1/20 | 0.56 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.56 |
| ▸ | ATM | Q13315 | 1/20 | 0.55 |
| ▸ | HTR1B | P28222 | 4/20 | 0.54 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.53 |
| ▸ | MCL1 | Q07820 | 6/20 | 0.50 |
| ▸ | BCL2 | P10415 | 3/20 | 0.50 |
| ▸ | BCL2L1 | Q07817 | 2/20 | 0.50 |
| ▸ | BAD | Q92934 | 2/20 | 0.50 |
| ▸ | SLC6A4 | P31645 | 2/20 | 0.50 |
| ▸ | HRH1 | P35367 | 1/20 | 0.50 |
| ▸ | ALB | P02768 | 1/20 | 0.50 |
| ▸ | CNR2 | P34972 | 1/20 | 0.49 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7644940 | 0.94 | KCNA3 (0.57) | KDM4EALDH1A1HPGDKCNA3TDP1 | |
| SCHEMBL1244995 | 0.93 | KDM4E (0.58) | KDM4EALDH1A1HPGDKCNA3TDP1 | |
| SCHEMBL29865493 | 0.84 | KDM4E (0.68) | KDM4EALDH1A1HPGDKCNA3TDP1 | |
| SCHEMBL5488944 | 0.84 | KDM4E (0.68) | KDM4EALDH1A1HPGDKCNA3TDP1 | |
| SCHEMBL7279604 | 0.81 | HTR1B (0.65) | KDM4EALDH1A1HPGDKCNA3TDP1 | |
| SCHEMBL3690758 | 0.81 | LMNA (0.48) | KDM4EALDH1A1ATMKMT2ACNR2 | |
| SCHEMBL4836971 | 0.80 | GAA (0.55) | KDM4EALDH1A1HPGDATMKMT2A | |
| SCHEMBL29865967 | 0.80 | CNR2 (0.71) | KDM4EALDH1A1HPGDKCNA3TDP1 | |
| SCHEMBL9580179 | 0.80 | HTR1B (0.58) | KDM4EALDH1A1HPGDKCNA3TDP1 | |
| SCHEMBL20911356 | 0.80 | CNR2 (0.71) | KDM4EALDH1A1HPGDKCNA3TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1295179-B1 | MULTIPHOTON CURING TO PROVIDE ENCAPSULATED OPTICAL ELEMENTS | 3M INNOVATIVE PROPERTIES CO (US) | 2013-05-22 | — | — | EP | claimed |
| US-7014988-B2 | Multiphoton curing to provide encapsulated optical elements | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2006-03-21 | — | — | US | claimed |
| EP-0441383-B1 | Use of a copolymer for the making of contact lenses | MITSUBISHI RAYON CO (JP) | 1996-05-08 | — | — | EP | claimed |
| EP-3517571-A1 | (METH)ACRYLIC COPOLYMER, RESIN COMPOSITION, MOLDED BODY OF SAME, AND METHOD FOR PRODUCING MOLDED BODY | Mitsubishi Gas Chemical Company, Inc. (JP) | 2019-07-31 | — | — | EP | disclosed |
| US-9605143-B2 | Resin composition for formation of optical waveguide, resin film for formation of optical waveguide which comprises the resin composition, and optical waveguide produced using the resin composition or the resin film | HITACHI CHEMICALS COMPANY, LTD. (JP) | 2017-03-28 | — | — | US | disclosed |
| US-20150353751-A1 | INKJET INK COMPOSITION, INKJET RECORDING METHOD, PRINTED MATERIAL, AND PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL | FUJIFILM CORPORATION (JP) | 2015-12-10 | — | — | US | disclosed |
| US-8787723-B2 | Resin composition for forming optical waveguide, resin film for forming optical waveguide, and optical waveguide | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-07-22 | — | — | US | disclosed |
| US-8632952-B2 | Photosensitive resin composition, photosensitive resin cured matter, photosensitive resin film, photosensitive resin film cured matter and optical waveguide obtained by using the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-01-21 | — | — | US | disclosed |
| US-8530118-B2 | Multiphoton curing to provide encapsulated optical elements | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2013-09-10 | — | — | US | disclosed |
| EP-2045629-B1 | RESIN COMPOSITION FOR OPTICAL WAVEGUIDE, RESIN FILM FOR OPTICAL WAVEGUIDE, AND OPTICAL WAVEGUIDE | HITACHI CHEMICAL CO LTD (JP) | 2013-09-04 | — | — | EP | disclosed |
| US-20130223803-A1 | RESIN COMPOSITION FOR FORMATION OF OPTICAL WAVEGUIDE, RESIN FILM FOR FORMATION OF OPTICAL WAVEGUIDE WHICH COMPRISES THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE PRODUCED USING THE RESIN COMPOSITION OR THE RESIN FILM | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-08-29 | — | — | US | disclosed |
| US-7601484-B2 | Multiphoton curing to provide encapsulated optical elements | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2009-10-13 | — | — | US | disclosed |
| US-20090196559-A1 | Resin Composition for Optical Materials, Resin Film for Optical Material, and Optical Waveguide | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-08-06 | — | — | US | disclosed |
| US-20090175585-A1 | Flexible Optical Waveguide and Optical Module | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-07-09 | — | — | US | disclosed |
| EP-2045629-A1 | RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE | Hitachi Chemical Company, Ltd. (JP) | 2009-04-08 | — | — | EP | disclosed |
| US-20060078831-A1 | Multiphoton curing to provide encapsulated optical elements | 3M INNOVATIVE PROPERTIES COMPANY | 2006-04-13 | — | — | US | disclosed |
| US-7014988-B2 | Multiphoton curing to provide encapsulated optical elements | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2006-03-21 | — | — | US | disclosed |
| US-20050208431-A1 | MULTIPHOTON CURING TO PROVIDE ENCAPSULATED OPTICAL ELEMENTS | 3M INNOVATIVE PROPERTIES COMPANY | 2005-09-22 | — | — | US | disclosed |
| EP-1295179-A2 | MULTIPHOTON CURING TO PROVIDE ENCAPSULATED OPTICAL ELEMENTS | 3M Innovative Properties Company (US) | 2003-03-26 | — | — | EP | disclosed |
| WO-2001096917-A2 | MULTIPHOTON CURING TO PROVIDE ENCAPSULATED OPTICAL ELEMENTS | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2001-12-20 | — | — | WO | disclosed |