SCHEMBL820756

SCHEMBL820756

O=C1NCCCCCCCCCN1

nearest known ligand 0.50

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
CRBN Q96SW2 3/20 0.50
FKBP5 Q13451 1/20 0.50
OR51E2 Q9H255 1/20 0.45
KDM4E B2RXH2 2/20 0.38
GAA P10253 1/20 0.38
POLB P06746 1/20 0.38
ALDH1A1 P00352 2/20 0.35
CCR2 P41597 1/20 0.33
TRIM24 O15164 1/20 0.32
TRIM33 Q9UPN9 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21423158 1.00 CRBN (0.50) CRBNFKBP5OR51E2KDM4EGAA
SCHEMBL820984 1.00 CRBN (0.50) CRBNFKBP5OR51E2KDM4EGAA
SCHEMBL540697 1.00
SCHEMBL820531 1.00 CRBN (0.50) CRBNFKBP5OR51E2KDM4EGAA
SCHEMBL1955052 1.00 CRBN (0.50) CRBNFKBP5OR51E2KDM4EGAA
SCHEMBL821040 1.00 CRBN (0.50) CRBNFKBP5OR51E2KDM4EGAA
SCHEMBL8089176 1.00 CRBN (0.50) CRBNFKBP5OR51E2KDM4EGAA
SCHEMBL820411 1.00 CRBN (0.50) CRBNFKBP5OR51E2KDM4EGAA
SCHEMBL279773 0.96
Hydrochloric Acid SCHEMBL11629900 0.93

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 65 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20100152313-A1 PROCESS FOR PREPARATION OF HIGH-MOLECULAR-WEIGHT POLYAMIDES BASF SE (DE) 2010-06-17 US claimed
US-20080312353-A1 Process for Preparation of High-Molecular-Weight Polyamides BASF AKTIENGESELLSCHAFT (DE) 2008-12-18 US claimed
EP-1776409-B1 METHOD FOR THE PRODUCTION OF HIGH-MOLECULAR POLYAMIDES BASF SE (DE) 2008-05-07 EP claimed
US-11643543-B2 Resin composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-05-09 US disclosed
US-20210380798-A1 RESIN COMPOSITION ASAHI KASEI KABUSHIKI KAISHA (JP) 2021-12-09 US disclosed
US-10774209-B2 Resin composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-09-15 US disclosed
US-20190203028-A1 Resin Composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2019-07-04 US disclosed
CN-106381555-A Composite fiber containing aggregation-induced luminescent molecules, preparation method thereof and application thereof 华南理工大学 2017-02-08 CN disclosed
US-9090770-B2 Polyacetal resin composition, method for producing the same, and molded article ASAHI KASEI CHEMICALS CORPORATION (JP) 2015-07-28 US disclosed
EP-2559731-A1 POLYACETAL RESIN COMPOSITION, PROCESS FOR PRODUCTION OF THE COMPOSITION, AND MOLDED ARTICLE Asahi Kasei Chemicals Corporation (JP) 2013-02-20 EP disclosed
US-20130035416-A1 POLYACETAL RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME, AND MOLDED ARTICLE ASAHI KASEI CHEMICALS CORPORATION (JP) 2013-02-07 US disclosed
US-4382525-A THERMOSETTING AND THERMOPLASTIC RESINS TOYO SEIKAN KAISHA, LTD. (JP) 1983-05-10 US disclosed
EP-0076634-A1 Process for preparation of metallic bottles TOYO SEIKAN KAISHA LIMITED (JP) 1983-04-13 EP disclosed
US-4217436-A N,N*-HYDROCARBYLENEDICARBONYLBIS/CYCLIC UREA/ THE UPJOHN COMPANY (US) 1980-08-12 US disclosed
US-4190599-A ACRYLATE COPOLYMER AND EPOXY RESIN THE UPJOHN COMPANY (US) 1980-02-26 US disclosed
US-4138398-A Bis-cyclic ureas THE UPJOHN COMPANY (US) 1979-02-06 US disclosed
US-3975463-A Molded structures containing crystalling polyolefin saponified ethylene vinyl acetate copolymer and carbonyl containing copolymers TOYO SEIKAN KAISHA LIMITED (JA) 1976-08-17 US disclosed
US-3947428-A BIS- OR TRIS-N,N-ETHYLENEUREA PROMOTER MITSUBOSHI BELTING LTD. (JA) 1976-03-30 US disclosed
US-3932692-A Resinious laminates having improved gas permeation and delamination resistance TOYO SEIKAN KAISHA LIMITED (JA) 1976-01-13 US disclosed
US-3931449-A Resinous laminates having improved gas permeation and resistance to delamination TOYO SEIKAN KAISHA LIMITED (JA) 1976-01-06 US disclosed