SCHEMBL821896

SCHEMBL821896

CCCCCCCCCCCc1nc(N)nc(N)n1

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CASP1 P29466 1/20 0.65
DHFR P00374 1/20 0.44
TLR8 Q9NR97 4/20 0.43
TLR7 Q9NYK1 2/20 0.43
ALDH1A1 P00352 3/20 0.42
KCNH2 Q12809 1/20 0.42
HRH4 Q9H3N8 1/20 0.40
ADORA3 P0DMS8 1/20 0.39
ADORA2A P29274 1/20 0.39
ADORA2B P29275 1/20 0.39
ADORA1 P30542 1/20 0.39
HPGD P15428 2/20 0.38
PKM P14618 1/20 0.38
HTR2A P28223 1/20 0.38
TSHR P16473 2/20 0.37
GPR84 Q9NQS5 1/20 0.37
THRB P10828 1/20 0.36
KDM4E B2RXH2 1/20 0.36
MEN1 O00255 1/20 0.36
USP2 O75604 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21327780 1.00 CASP1 (0.65) CASP1DHFRTLR8TLR7ALDH1A1
SCHEMBL113501 1.00 CASP1 (0.65) CASP1DHFRTLR8TLR7ALDH1A1
SCHEMBL821678 1.00 CASP1 (0.65) CASP1DHFRTLR8TLR7ALDH1A1
SCHEMBL379144 1.00 CASP1 (0.65) CASP1DHFRTLR8TLR7ALDH1A1
SCHEMBL8141652 1.00 CASP1 (0.65) CASP1DHFRTLR8TLR7ALDH1A1
SCHEMBL9488393 1.00 CASP1 (0.65) CASP1DHFRTLR8TLR7ALDH1A1
SCHEMBL10983992 1.00 CASP1 (0.65) CASP1DHFRTLR8TLR7ALDH1A1
SCHEMBL11408908 1.00 CASP1 (0.65) CASP1DHFRTLR8TLR7ALDH1A1
SCHEMBL1639952 0.98 CASP1 (0.68) CASP1DHFRTLR8TLR7ALDH1A1
SCHEMBL2623157 0.95 CASP1 (0.58) CASP1DHFRTLR8TLR7ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12459193-B2 Method and kit for non-destructive in situ repair (relining) of deteriorated pipelines APPLIED RESIN S L (ES) 2025-11-04 US claimed
WO-2025072028-A1 POLISHING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2025-04-03 WO claimed
US-20250101263-A1 POLISHING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2025-03-27 US claimed
EP-4225557-B1 METHOD AND KIT FOR NON-DESTRUCTIVE IN SITU REPAIR (RELINING) OF DETERIORATED PIPELINES APPLIED RESIN S L (ES) 2025-02-19 EP claimed
US-20230312987-A1 Method, kit and composition for non-destructive in situ repair or relining of deteriorated pipelines with a dual use system APPLIED RESIN S.L. (ES) 2023-10-05 US claimed
EP-4253819-A1 METHOD, KIT AND COMPOSITION FOR NON-DESTRUCTIVE IN SITU REPAIR (RELINING) OF DETERIORATED PIPELINES WITH A DUAL USE SYSTEM Applied Resin S.L. (ES) 2023-10-04 EP claimed
EP-4225557-A1 METHOD AND KIT FOR NON-DESTRUCTIVE IN SITU REPAIR (RELINING) OF DETERIORATED PIPELINES Applied Resin S.L. (ES) 2023-08-16 EP claimed
CN-116478361-A Self-repairing antibacterial aqueous polyurethane and preparation method and application thereof 陕西科技大学 2023-07-25 CN claimed
CN-116396562-A Outdoor PP material with high weather resistance and high chromaticity and preparation method thereof 奥美凯聚合物(苏州)有限公司 2023-07-07 CN claimed
WO-2022074545-A1 METHOD AND KIT FOR NON-DESTRUCTIVE IN SITU REPAIR (RELINING) OF DETERIORATED PIPELINES APPLIED RESIN S.L. (ES) 2022-04-14 WO claimed
CN-111944522-A Preparation method and application of single-component carbon-based solid white luminescent nano material 盐城工学院 2020-11-17 CN claimed
EP-0397582-B1 Imide groups containing polymers made from hindered diamines CIBA GEIGY AG (CH) 1994-12-14 EP claimed
US-5122590-A Addition-condensation copolymer comprising an N,N*-bismaleimide, hindered aromatic diprimary diamine, a diamino-s-triazine, a halogenated epoxy resin and a diallyl oxylated benzene; heat resistance; prepregs RHONE-POULENC CHIMIE (FR) 1992-06-16 US claimed
CN-121045719-A Low-smoke composite antimony trioxide flame retardant and preparation method thereof 益阳市华昌锑业有限公司 2025-12-02 CN disclosed
US-12459193-B2 Method and kit for non-destructive in situ repair (relining) of deteriorated pipelines APPLIED RESIN S L (ES) 2025-11-04 US disclosed
US-20250257286-A1 CLEANING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2025-08-14 US disclosed
US-5198516-A THERMALLY STABLE BISIMIDO/P-ALLYLANILINE COPOLYMERS CIBA-GEIGY CORPORATION (US) 1993-03-30 US disclosed
US-5122590-A Addition-condensation copolymer comprising an N,N*-bismaleimide, hindered aromatic diprimary diamine, a diamino-s-triazine, a halogenated epoxy resin and a diallyl oxylated benzene; heat resistance; prepregs RHONE-POULENC CHIMIE (FR) 1992-06-16 US disclosed
US-4486373-A Method for producing reinforced thermoplastic resin composition KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO (JP) 1984-12-04 US disclosed
US-4211688-A Process for dyeing high-molecular organic material in the melt CIBA-GEIGY CORPORATION (US) 1980-07-08 US disclosed